One or more examples relate, generally, to an apparatus. The apparatus includes a charged particle source and a charged particle pointer. The charged particle pointer urges charged particles emitted by the charged particle source in a predetermined direction. The charged particle pointer comprises a repeller, and an isolator positioned along a path extending from the repeller in the predetermined direction.

An ion source for forming a plasma has a cathode with a cavity and a cathode surface defining a cathode step. A filament is disposed within the cavity, and a cathode shield has a cathode shield surface at least partially encircling the cathode surface. A cathode gap is defined between the cathode surface and the cathode shield surface, where the cathode gap defines a tortured path for limiting travel of the plasma through the gap. The cathode surface can have a stepped cylindrical surface defined by a first cathode diameter and a second cathode diameter, where the first cathode diameter and second cathode diameter differ from one another to define the cathode step. The stepped cylindrical surface can be an exterior surface or an interior surface. The first and second cathode diameters can be concentric or axially offset.

A system for extending the life of a repeller in an IHC ion source is disclosed. The system includes an IHC ion source wherein the back surface of the repeller has been shaped to reduce the possibility of electrical shorts. The separation distance between the back surface of the repeller and the chamber wall behind the repeller is increased along its outer edge, as compared to the separation distance near the center of the repeller. This separation distance reduces the possibility that deposited material will flake and short the repeller to the chamber wall. Further, in certain embodiments, the separation distance between the back surface of the repeller and the chamber wall near the center of the repeller is unchanged, so as to minimize the flow of gas that exits from the chamber. The back surface of the repeller may be tapered, stepped or arced to achieve these criteria.

An ion source for forming a plasma has a cathode with a cavity and a cathode surface defining a cathode step. A filament is disposed within the cavity, and a cathode shield has a cathode shield surface at least partially encircling the cathode surface. A cathode gap is defined between the cathode surface and the cathode shield surface, where the cathode gap defines a tortured path for limiting travel of the plasma through the gap. The cathode surface can have a stepped cylindrical surface defined by a first cathode diameter and a second cathode diameter, where the first cathode diameter and second cathode diameter differ from one another to define the cathode step. The stepped cylindrical surface can be an exterior surface or an interior surface. The first and second cathode diameters can be concentric or axially offset.

Thermionic cathodes and an electron emission apparatus are provided. The thermionic cathodes comprise perovskite material in crystal or sintered form. The thermionic cathodes provide strong electron emission at low operating temperatures.

A monolithic graphite heater for heating a thermionic electron cathode includes first and second electrically conductive arms, each one of the first and second electrically conductive arms having an electrode mount at a proximal end, a thermal apex at a distal end, and a transitional region between the electrode mount and the thermal apex; a cathode mount electrically and mechanically coupling each thermal apex to form a maximum Joule-heating region at or adjacent the cathode mount and decreasing Joule heating along each transitional region; and a press-fit aperture formed in the cathode mount, the press-fit aperture sized to receive at least a portion of the thermionic electron cathode for facilitating thermionic emission produced therefrom in response to operative heat power generation provided by the maximum Joule-heating region.

The present invention relates to an electron gun cathode mount adapted at one end to secure a thermionic cathode and at the other end to be connected to an attachment member, wherein the electron gun cathode mount is structured so as to be capable of, when in use, reducing heat transfer from the thermionic cathode to the attachment member, and the material forming the electron gun cathode mount has a thermal conductivity of less than 10 Wm.sup.?1K.sup.?1 at the operating temperature of the thermionic cathode in a direction from the thermionic cathode to the attachment member. The present invention also relates to an electron gun assembly having the electron gun cathode mount installed therein.

A cathode device includes an emitter tip for generating electrons. An elongate heater is included having proximal and distal ends. The emitter tip can be located at the distal end of the heater. Two spaced apart legs can extend away from the distal end of the heater, terminating at the proximal end and forming an elongate slot therebetween. Two electrical contacts can compressively engage respective opposite outer surfaces of the two legs at the proximal end of the heater to mechanically secure and electrically connect the two legs of the heater to respective electrical contacts at a junction that is at a location spaced away from the emitter tip to keep the junction cooler.

The present invention relates to an electron gun cathode mount adapted at one end to secure a thermionic cathode and at the other end to be connected to an attachment member, wherein the electron gun cathode mount is structured so as to be capable of, when in use, reducing heat transfer from the thermionic cathode to the attachment member, and the material forming the electron gun cathode mount has a thermal conductivity of less than 10 Wm.sup.1K.sup.1 at the operating temperature of the thermionic cathode in a direction from the thermionic cathode to the attachment member. The present invention also relates to an electron gun assembly having the electron gun cathode mount installed therein.

The present invention is a High-Power Plasma Electron Beam Installation (HPPEBI) system. The system comprises a cathode configured to generate high-energy electron beams within a vacuum chamber, an anode to stabilize the plasma, wherein the focus of the electron beam is based on cathode geometry, enabling cylindrical, circular, point, or linear configurations. The electron beam delivers energy directly to the target material, inducing localized heating, melting, evaporation, or structural modifications with minimal impact on surrounding areas. The system facilitates precise and efficient processes, such as phase transformations, thin film deposition, and defect creation, enhancing material properties. Cooling mechanisms integrated with the cathode and anode prevent overheating during high-energy operations.