An ultra-high vacuum seal assembly includes a circuit board, a first ring, and a second ring. The first ring and the second ring include indium. The circuit board includes a first surface and a second surface that is opposite the first surface. The circuit board also includes a via array that is in electrical communication with the first surface and the second surface of the circuit board. The first ring is positioned directly on the first surface of the circuit board and the second ring is positioned directly on the second surface of the circuit board.