Patent classifications
H01J2211/446
Electromagnetic Shielding Film and Shielded Printed Wiring Board Including the Same
It is an object of the present invention to provide an electromagnetic shielding film having excellent high frequency signal transmission characteristics and excellent shielding characteristics against electromagnetic waves in a high frequency region and a shielded printed wiring board including the same. An electromagnetic shielding film 1 includes a shielding layer that is formed by a first metal layer mainly comprised of nickel and a second metal layer mainly comprised of copper, an adhesive layer formed on the second metal layer side of the shielding layer, and a protective layer formed on the first metal layer side of the shielding layer which is the opposite side of the shielding layer from the second metal layer side. The first metal layer has a thickness T.sub.1 of 2 m or more and 10 m or less, and the second metal layer has a thickness T.sub.2 of 2 m or more and 10 m or less.