A sputtering apparatus includes a base on which a substrate is mounted, an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without in contact with the substrate, and an edge cover that covers an outer edge of an upper surface of the substrate mounted on the base. The annular member has a first surface facing the backside of the substrate mounted on the base with a gap, a second surface facing the side surface of the substrate mounted on the base with a gap, and a tapered surface formed at a corner portion between the first surface and the second surface.

A sputtering apparatus includes a base on which a substrate is mounted, an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without in contact with the substrate, and an edge cover that covers an outer edge of an upper surface of the substrate mounted on the base. The annular member has a first surface facing the backside of the substrate mounted on the base with a gap, a second surface facing the side surface of the substrate mounted on the base with a gap, and a tapered surface formed at a corner portion between the first surface and the second surface.

In a system and method of shadow mask tensioning, an object having second set of alignment features is positioned on a side of shadow mask having a first set of alignment features such that the object and the shadow mask can move independently of each other and the first and second sets of alignment features are not in final alignment. Tension is then applied to the shadow mask to bring the first set of alignment features into final alignment with the second set of alignment features. The alignment features of the shadow mask can include at least one deposition aperture of the shadow mask.