A treatment system and process includes a ribbon beam ion source that is configured to implant ions into a product to modify a portion of the product; multiple means of controlling the temperature of the product; the means including radiative conduction, gas conduction to a heatsink by means of a gas cushion, adjustment of the ion beam density at the product, adjustment of the ion beam intensity at the product and ion beam acceleration parameters, and adjustment of the ion dose to the product b; and a product movement system configured to move the product through the treatment system past the ribbon beam ion source. The treatment system further includes a system controller configured to control at least one the following: the gas cushion system, the ribbon beam ion source, the temperature control system, the heatsink, and the product movement system.

A particle beam system includes a multi-source system. The multi-source system comprises an electron emitter array as a particle multi-source. The inhomogeneous emission characteristics of the various emitters in this multi-source system are correctable, or pre-correctable for subsequent particle-optical imaging, via particle-optical components that are producible via MEMS technology. A beam current of the individual particle beams is adjustable in the multi-source system.

The present invention provides an apparatus of electron beam comprising an electron gun with a pinnacle limiting plate having at least one current-limiting aperture. The pinnacle limiting plate is located between a bottom (or lowest) anode and a top (or highest) condenser within the electron gun. A current (ampere) of the electron beam that has passed through the current-limiting aperture remains the same (unchanged) after the electron beam travels through the top condenser and an electron optical column and arrives at a sample space. Electron-electron interaction of the electron beam is thus reduced.

Provided is a sample milling apparatus capable of milling various samples efficiently. The sample milling apparatus includes an anode, a cathode for emitting electrons which are made to collide with gas molecules so that ions are generated, an extraction electrode for causing the generated ions to be extracted as an ion beam, and a focusing electrode disposed between the cathode and the extraction electrode and applied with a focusing voltage. The spatial profile of the ion beam is controlled by varying the focusing voltage applied to the focusing electrode.

In an exemplary process for lower dose rate ion implantation of a work piece, an ion beam may be generated using an ion source and an extraction manipulator. The extraction manipulator may be positioned at a gap distance from an exit aperture of the ion source. A current of the ion beam exiting the extraction manipulator may be maximized when the extraction manipulator is positioned at an optimal gap distance from the exit aperture. The gap distance at which the extraction manipulator is positioned from the exit aperture may differ from the optimal gap distance by at least 10 percent. A first potential may be applied to a first set of electrodes. An x-dimension of the ion beam may increase as the ion beam passes through the first set of electrodes. The work piece may be positioned in the ion beam to implant ions into the work piece.

The invention provides an exposure apparatus (100) including a formation module (122) which forms charged particle beams with different irradiation positions on a specimen. The formation module (122) includes: a particle source (20) which emits the charged particle beams from an emission region (21) in which a width in a longitudinal direction is different from and a width in a lateral direction orthogonal to the longitudinal direction; an aperture array device (60) provided with openings (62) arranged in an illuminated region (61) in which a width in a longitudinal direction is different from a width in a lateral direction orthogonal to the longitudinal direction; illumination lenses (30, 50) provided between the particle source (20) and the aperture array device (60); and a beam cross-section deformation device (40) which is provided between the particle source (20) and the aperture array device (60), and deforms a cross-sectional shape of the charged particle beams into an anisotropic shape by an action of a magnetic field or an electric field.

Provided is a device for optimizing a diffusion section of an electron beam, comprising two groups of permanent magnets, a magnetic field formed by the four magnetic poles extending the electron beam in a longitudinal direction, and compressing the electron beam in a transverse direction, so that the electron beam becomes an approximate ellipse; another magnetic field formed by the eight magnetic poles optimizing an edge of a dispersed electron-beam bunch into an approximate rectangle; by controlling the four longitudinal connection mechanisms so that the upper magnetic yoke and the lower magnetic yoke of the first group of permanent magnets move synchronously towards the center thereof thereby longitudinally compressing the electron beam in the shape of an approximate ellipse, and the upper magnetic yoke and the lower magnetic yoke of the second group of permanent magnets move synchronously towards the center thereof thereby longitudinally compressing the electron beam in the shape of an approximate rectangle, and the process of longitudinal compression is repeated until a longitudinal size of the electron-beam bunch is reduced to 80 mm. The invention is capable of reasonably compressing a longitudinal size of an electron-beam bunch after diffusion to approximately 80 mm, which ensures optimum irradiation uniformity and efficiency, and enables the longitudinal size to be within the range of a conventional titanium window.

A system for manufacturing of three dimensional objects by layered deposition is provided. The system includes a base substrate for formation of three dimensional objects placed on a supporting plate; a functional assembly comprising a gas-discharge electron beam gun, a feedstock guide, a cold annular cathode and two annular anode electrodes, a high voltage power supply of the gas-discharge electron beam gun, a system of precise positioning of the supporting plate with the base substrate), a vacuum tight operation chamber, a vacuum subsystem for creating of necessary vacuum inside said operating chamber, a control system and a magnetic lens. The lens is placed on the underside of the gas-discharge electron beam gun coaxially with it and with the feedstock guide, providing the possibility of transformation of a primary hollow electron beam to the shape of a hollow inverted cone after leaving the discharge chamber of the gas-discharge electron beam gun.

To provide a three-dimensional printing device that irradiates approximately the same ranges on the surface of a powder layer simultaneously with a plurality of electron beams having different beam shapes. An electron beam column 200 of the three-dimensional printing device 100 includes a plurality of electron sources 20 including electron sources having anisotropically-shaped beam generating units, and beam shape deforming elements 30 that deform the beam shapes of electron beams output from the electron sources 20 on a surface 63 of a powder layer 62. A deflector 50 included in the electron beam column 200 deflects an electron beam output from each of the plurality of electron sources 20 by a distance larger than the beam space between electron beams before passing through the deflector 50.

An ion source for improving beam transport efficiency regarding a ribbon beam is provided. The plasma generation container is formed with a beam extraction port at an end thereof. The shielding member plugs the beam extraction port and comprises three or more elongate holes each of which is long in a lateral direction of a ribbon beam to be extracted through the shielding member and which are arranged in the form of an array extending in the lateral direction, wherein a first length one of the elongate holes located in a central region of the array is shorter than a second length of one of the remaining elongate holes located on an end side of the array.