Patent classifications
H01J2237/1504
BLANKING APERTURE ARRAY UNIT
A blanking aperture array unit according to the present embodiment includes a chip configured to control a charged particle beam by blanking control of switching whether to irradiate a target with the charged particle beam; a substrate having the chip mounted thereon; a wire configured to electrically connect pads on the chip to the substrate and transmit a control signal for the blanking control from the substrate to the chip through the pads; and a conductive covering member having a first end connected to the substrate and a second end located on the chip, the covering member being provided from the first end to the second end to cover the wire while maintaining electrical insulation from the wire, and at least two end sides of the second end of the covering member are nearer a central portion of the chip than locations of the pads on the chip.
Multi-leaf collimator
The present disclosure relates a multi-leaf collimator. The multi-leaf collimator may include a plurality of leaves. At least two leaves of the plurality of leaves may be movable parallel to each another. For each leaf of at least some of the plurality of leaves, at least one portion of the leaf may have thicknesses varying along a longitudinal direction of the each leaf. The each leaf may have a first end and a second end along the longitudinal direction of the each leaf.
CHARGED PARTICLE BEAM SCANNING MODULE, CHARGED PARTICLE BEAM DEVICE, AND COMPUTER
A charged particle beam scanning module, a charged particle beam device, and a computer that can correct an INL error in a DAC circuit in real time. The charged particle beam scanning module includes a scanning controller configured to output a scanning digital signal of a charged particle beam, a DAC circuit configured to convert the scanning digital signal into a scanning analog signal and output the scanning analog signal, and an ADC circuit configured to convert the scanning analog signal into an evaluation digital signal. A sampling frequency at which the DAC circuit samples the scanning digital signal is a first frequency, and a sampling frequency at which the ADC circuit samples the scanning analog signal is a second frequency smaller than the first frequency. The scanning controller determines an output characteristic of the DAC circuit by evaluating the scanning digital signal and the evaluation digital signal.
MULTI-BEAM DIGITAL SCAN AND IMAGE ACQUISITION
A multi-beam charged particle microscope and a method of operating a multi-beam charged particle microscope for wafer inspection with high throughput and with high resolution and high reliability are provided. The method of operation and the multi-beam charged particle beam microscope comprises a mechanism for a synchronized scanning operation and image acquisition by a plurality of charged particle beamlets according a selected scan program, wherein the selected scan program can be selected according an inspection task from different scan programs.
MULTI-ELECTRON BEAM INSPECTION APPARATUS, MULTIPOLE ARRAY CONTROL METHOD, AND MULTI-ELECTRON BEAM INSPECTION METHOD
A multi-electron beam inspection apparatus includes first sample hold circuits, each configured to include a capacitor and a switch arranged for each of electrodes of each of a plurality of multipoles, and to hold, using the capacitor and the switch, a potential to be applied to the each of the electrodes, power sources configured to apply potentials to the plurality of first sample hold circuits, a control circuit configured to control the plurality of first sample hold circuits such that the plurality of potentials having been applied to the plurality of first sample hold circuits are held, in synchronization with swinging back of the collective beam deflection by the objective deflector, by a plurality of second sample hold circuits selected from the plurality of first sample hold circuits, and a detector configured to detect multiple secondary electron beams emitted because the substrate is irradiated with the multiple primary electron beams.
Charged particle beam apparatus and control method
A charged particle beam apparatus acquires an image that is not affected by movement of a stage at a high speed. The apparatus includes: a charged particle source for irradiating a sample with a charged particle beam; a stage on which the sample is placed; a measurement unit for measuring a movement amount of the stage; a deflector; a deflector offset control unit, which is a feedback control unit for adjusting a deflection amount of the deflector according to the movement amount of the stage; a plurality of detectors for detecting secondary charged particles emitted from the sample by irradiation of the charged particle beam; a composition ratio calculation unit that calculates composition ratios of signals output from the detectors based on the deflection amount adjusted by the feedback control unit; and an image generation unit for generating a composite image by compositing the signals using the composition ratio.
CHARGED PARTICLE ASSESSMENT TOOL, INSPECTION METHOD
A charged-particle tool including: a condenser lens array configured to separate a beam of charged particles into a first plurality of sub-beams along a respective beam path and to focus each of the sub-beams to a respective intermediate focus; an array of objective lenses, each objective lens configured to project one of the plurality of sub-beams onto a sample; a corrector including an array of elongate electrodes, the elongate electrodes extending substantially perpendicular to the beam paths of the first plurality of sub-beams and arranged such that a second plurality of the sub-beams propagate between a pair of the elongate electrodes, the second plurality of sub-beams being a subset of the first plurality of sub-beams; and an electric power supply configured to apply a potential difference between the pair of elongate electrodes so as to deflect the second plurality of sub-beams by a desired amount.
Multi-beam writing method and multi-beam writing apparatus
A multi-beam writing method includes acquiring a plurality of deflection coordinates for deflecting a beam to each of a plurality of pixels which are in each beam pitch region of a plurality of beam pitch regions, a number of pixels to be exposed by a beam in the each beam pitch region during each of tracking control period performed such that the multiple beams collectively follow a movement of a stage, and a deflection movement amount of the multiple beams at a time of tracking reset for resetting a tracking starting position after each of the tracking control period has passed; and generating a deflection sequence defined using the plurality of deflection coordinates, the number of pixels to be exposed during each of the tracking control period, and the deflection movement amount of the multiple beams at the time of tracking reset.
SCANNING ELECTRON MICROSCOPE
The present invention relates to a scanning electron microscope configured to scan a workpiece, such as a wafer, mask, panel, or substrate, with an electron beam to generate an image of the workpiece. The scanning electron microscope includes a deflector (17, 18) configured to deflect the electron beam to scan a target region (T) on the workpiece (W) with the electron beam, and a deflection controller (22) configured to apply to the deflectors (17, 18) a scanning voltage that causes the electron beam to scan the target region (T) and an offset voltage that shifts the electron beam from an optical axial center (O) to the target region (T).
MULTI-LEAF COLLIMATOR
The present disclosure relates a multi-leaf collimator. The multi-leaf collimator may include a plurality of leaves. At least two leaves of the plurality of leaves may be movable parallel to each another. For each leaf of at least some of the plurality of leaves, at least one portion of the leaf may have thicknesses varying along a longitudinal direction of the each leaf. The each leaf may have a first end and a second end along the longitudinal direction of the each leaf.