The present inventive concept relates to a substrate processing device and a substrate processing method. The substrate processing device comprises: a chamber; a substrate support part rotatably installed in a process space inside the chamber so as to allow at least one substrate to be seated thereon; a first gas spray unit for spraying, to a first region of the process space, a source gas and a first purge gas for purging the source gas; a source gas supply source for supplying the source gas to the first gas spray unit; a first purge gas supply source for supplying the first purge gas to the first gas spray unit; a second gas spray unit spatially separated from the first region and configured to spray, to a second region of the process space, a reactant gas reacting with the source gas and a second purge gas for purging the reactant gas; a reactant gas supply source for supplying the reactant gas to the second gas spray unit; and a second purge gas supply source for supplying the second purge gas to the second gas spray unit.

A sample transfer device (100) for receiving a sample inside the sample transfer device (100) and for transferring the sample to a processing or analysing unit includes a connection opening (110) defining a transfer path (114) along which the sample is to be transferred from a loading position (120) of the sample inside the sample transfer device (100) through the connection opening (110), a shutter (130) configured to block the connection opening (110) or to unblock the connection opening (110), and a shielding member (140) configured to be arranged between the connection opening (110) and the loading position (120) to protect the sample from an incoming gas stream when the shutter (130) unblocks the connection opening (110).

A rapid and automatic virus imaging and analysis system includes (i) electron optical sub-systems (EOSs), each of which has a large field of view (FOV) and is capable of instant magnification switching for rapidly scanning a virus sample; (ii) sample management sub-systems (SMSs), each of which automatically loads virus samples into one of the EOSs for virus sample scanning and then unloads the virus samples from the EOS after the virus sample scanning is completed; (iii) virus detection and classification sub-systems (VDCSs), each of which automatically detects and classifies a virus based on images from the EOS virus sample scanning; and (iv) a cloud-based collaboration sub-system for analyzing the virus sample scanning images, storing images from the EOS virus sample scanning, and storing and analyzing machine data associated with the EOSs, the SMSs, and the VDCSs.

The invention concerns a crucible assembly for physical vapor deposition on a surface comprising: a base (22) to support and drive in rotation a crucible (18) around a rotational axis (A), the base comprising a base upper surface (34) having a first alignment relief (30), a crucible (18) comprising: at least one cavity (24) disposed at a peripheral area (38) of the crucible (18) with regard to the rotational axis (A), a crucible bottom surface (25) intended to contact the base upper surface (34) of the base (22), the crucible bottom surface (25) having a second alignment relief (32) which is complementary shaped with regard to the first alignment relief (30), the second (32) alignment relief being disposed at a central area (36) of the crucible (18) with regard to the rotation axis (A).

A thin film liquid cell suitable for transmission electron microscopy at room temperature is fabricated as follows. A thin film floating on a liquid is prepared. A droplet of the liquid with the thin film floating thereon is transferred to a support by means of a loop. The loop carries the droplet and the droplet carries the thin film during this transfer. Sufficient liquid from the droplet on the support is removed to form the thin film liquid cell.

A substrate processing apparatus includes: a vacuum transfer chamber including a substrate transfer mechanism provided in a vacuum transfer space thereof to collectively hold and transfer substrates with a substrate holder; and a processing chamber having processing spaces and connected to the vacuum transfer chamber. The processing chamber includes a loading/unloading port provided on a side of the vacuum transfer chamber to allow the vacuum transfer space and the processing spaces to communicate with each other. The processing spaces include a first processing space in which a first process is performed on the substrate and a second processing space in which a second process is performed on the substrate subjected to the first process. The first and second processing spaces are arranged in a direction in which the substrate is loaded and unloaded, and the substrate holder has a length that extends over the first and second processing spaces.

A semiconductor analysis system includes a machining device that machines a semiconductor wafer to prepare a thin film sample for observation, a transmission electron microscope device that acquires a transmission electron microscope image of the thin film sample, and a host control device that controls the machining device and the transmission electron microscope device. The host control device evaluates the thin film sample based on the transmission electron microscope image, updates acquisition conditions of the transmission electron microscope image based on an evaluation result of the thin film sample, and outputs the updated acquisition conditions to the transmission electron microscope device

Embodiments of the present disclosure provide a grid structure. The grid structure includes a carrier and a support column; wherein the support column is located on the carrier, the support column has a top surface for supporting a sample; and the support column has a groove, the groove extends along a direction from the top surface to the carrier, and a groove wall of the groove is connected to the top surface.

A lamella 10 including an analysis portion 11 and a cutout portion 12 separated from the analysis portion 11 is produced. When a plurality of the lamellae 10 are transported to a lamella grid 20, the plurality of lamellae 10 are supported by a support portion 22 protruding from a surface of a substrate 21, and are mounted adjacent to each other in a Z direction. At this time, the cutout portion 12 prevents the analysis portion 11 from damage.

A semiconductor manufacturing apparatus includes: a processing container that accommodates a substrate holder that holds a plurality of substrates in a shelf shape; a gas supply that supplies a processing gas into the processing container; and a microwave introducer that generates a plasma from the processing gas. The microwave introducer includes: a rectangular waveguide provided along a length direction of the processing container and including a plurality of slots that radiates microwaves; and a phase controller that is provided at an end of the rectangular waveguide and controls a phase of the microwaves propagating in the rectangular waveguide.