A nanoscale positioning system for positioning a positionable component includes a motion platform including a first end, a second end, a shuttle positioned between the first end and the second end and configured to support the positionable component, a flexure member, and a fluid passage extending through the flexure member from the first end to the second end of the motion platform, and a pressure controller coupled to the motion platform and fluidically connected to the fluid passage, wherein the pressure controller is configured to selectably provide a fluid pressure in the fluid passage to flex the flexure member whereby the shuttle is displaced along a motion axis of the motion platform.

Computer-implemented methods for controlling a charged particle microscopy system include estimating a drift of a stage of the charged particle microscopy system based on an image sequence, and automatically adjusting a stage settling wait duration based on the drift estimate. Charged particle microscopy systems include an imaging system, a movement stage, and a processor and memory configured with computer-executable instructions that, when executed, cause the processor to estimate a stage settling duration of the movement stage based on an image sequence obtained with the imaging system, and automatically adjust a stage settling wait duration for the movement stage based on the stage settling duration.

A substrate processing apparatus, includes a reaction chamber, a central processing volume within a vertically oriented central processing portion of the reaction chamber, to expose at least one substrate to self-limiting surface reactions in the central processing volume, at least two lateral extensions in the reaction chamber laterally extending from the central processing portion, and an actuator configured to reversibly move at least one substrate between the lateral extension(s) and the central processing volume.

A method of producing a compensation signal to compensate for misalignment of a drive unit clamp element can include applying a clamp element drive signal to a drive unit clamp element to engage a mover element. A first displacement of the mover element can be determined. A first compensation signal to be applied to one or more drive unit shear elements can be determined based at least in part on the first displacement. The first compensation signal can be applied to the one or more drive unit shear elements and the clamp element drive signal can be applied to the drive unit clamp element. A second displacement can be determined in response to the application of the first compensation signal and the clamp element drive signal. The second displacement can then be compared to a preselected threshold. For a second displacement less than the preselected threshold, combining the first compensation signal with an initial shear element drive signal to produce a modified shear element drive signal, and for a second displacement greater than the preselected threshold, determining a second compensation signal to be applied to the one or more drive unit shear elements.

The present invention provides: a stage device that can suppress bending deformation of a mirror, and that can reduce the positioning error of a stage by reducing the measurement error of the position of the stage; and a charged particle beam device comprising this stage device. The stage device according to the present invention comprises: a table (105) on which a sample (106) is placed; a bar mirror (111) installed on the table (105); a laser interferometer (104) that irradiates the bar mirror (111) with laser light and receives reflected light from the bar mirror (111), thereby measuring the position of the table (105); a drive mechanism (103) that moves the table (105); and a plurality of elastic members (203) installed between the bar mirror (111) and the table (105)

A sample holder (19) includes a base portion (41), a sample carrying portion (42), a rotation guide portion (43), a cooling stage (46), a connection member (47), a first support portion, and a fixing guide portion (48). The base portion (41) is configured to be fixed to a stage (12), which is configured to be driven to rotate by a stage driving mechanism (13). The rotation guide portion (43) is configured to guide synchronous rotation of the base portion (41) and the sample carrying portion (42). The cooling stage (46) is configured to cool a sample (S). The connection member (47) is configured to be connected to the cooling stage (46). The first support portion is configured to support the base portion (41), which is configured to be driven to rotate by the stage (12).

There is provided an electron beam inspection system which can enhance the safety of the whole system if servo valves are deactivated in the event of a power failure or an emergency stop. The electron beam inspection system has a beam source, a stage mechanism, and a pump. The stage mechanism has a guide shaft, a slider, a first servo valve, a second servo valve, a first exhaust pipe, a second exhaust pipe, and an exhaust valve. The slider is movably supported to the guide shaft via a hydrostatic bearing and has a first pressure subchamber and a second pressure subchamber. The exhaust valve is mounted in the first exhaust pipe. When the servo valves are in operation, the exhaust valve is opened. When supply of electric power to the servo valves is ceased, the exhaust valve is closed.

A treatment system and process includes a ribbon beam ion source that is configured to implant ions into a product to modify a portion of the product; multiple means of controlling the temperature of the product; the means including radiative conduction, gas conduction to a heatsink by means of a gas cushion, adjustment of the ion beam density at the product, adjustment of the ion beam intensity at the product and ion beam acceleration parameters, and adjustment of the ion dose to the product b; and a product movement system configured to move the product through the treatment system past the ribbon beam ion source. The treatment system further includes a system controller configured to control at least one the following: the gas cushion system, the ribbon beam ion source, the temperature control system, the heatsink, and the product movement system.

The purpose of the present invention is to correct a beam irradiation position shift caused by charging phenomena with high accuracy. A charged particle beam writing method includes virtually dividing a writing region of the substrate so as to have a predetermined mesh size and calculating a pattern density distribution representing an arrangement ratio of the pattern for each mesh region, calculating a dose distribution using the pattern density distribution, calculating an irradiation amount distribution using the pattern density distribution and the dose distribution, calculating a fogging charged particle amount distribution, calculating a charge amount distribution due to direct charge and a charge amount distribution due to fogging charge, calculating a position shift of a writing position based on the charge amount distribution due to direct charge and the charge amount distribution due to fogging charge, correcting an irradiation position using the position shift, and irradiating the corrected irradiation position with the charged particle beam with which a potential of a surface of the substrate becomes higher than a potential of a bottom surface of ae potential regulation member.

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.