A GUI (graphical user interface) image includes an input portion and a reference image. The reference image includes a plan diagram and numerical value information. The plan diagram includes a figure indicating an electron penetration range, a figure indicating a characteristic X-ray generation range, and a figure indicating a back-scattered electron generation range. The numerical value information includes numerical values indicating sizes of these ranges.

A UI image includes a reference image, which includes a background image and a schematic image. The background image corresponds to a cross section of a specimen having a multilayer structure. The schematic image includes a figure indicating an electron penetration depth, a figure indicating a characteristic X-ray generation depth, and a figure indicating a back-scattered electron generation depth. These figures are displayed in an overlapping manner or in parallel to each other.

The present disclosure addresses the problem of providing an electron gun that can directly monitor an intensity of an electron beam emitted from a photocathode using only the configuration provided to the electron gun, an electron beam applicator equipped with an electron gun, and a method for controlling an electron gun.

The aforementioned problem can be solved by an electron gun comprising a light source, a photocathode that emits an electron beam in response to receiving light from the light source, an anode, an electron-beam-shielding member with which it is possible to shield part of the electron beam, and a measurement unit that measures the intensity of the electron beam emitted from the photocathode using a measurement electron beam shielded by the electron-beam-shielding member.

Some embodiments include a high voltage, high frequency switching circuit. The switching circuit may include a high voltage switching power supply that produces pulses having a voltage greater than 1 kV and with frequencies greater than 10 kHz and an output. The switching circuit may also include a resistive output stage electrically coupled in parallel with the output and between the output stage and the high voltage switching power supply, the resistive output stage comprising at least one resistor that discharges a load coupled with the output. In some embodiments, the resistive output stage may be configured to discharge over about 1 kilowatt of average power during each pulse cycle. In some embodiments, the output can produce a high voltage pulse having a voltage greater than 1 kV and with frequencies greater than 10 kHz with a pulse fall time less than about 400 ns.

A plasma processing method in which a stable process region can be ensured in a wide range, from low microwave power to high microwave power. The plasma processing method includes making production of plasma easy in a region in which production of plasma by continuous discharge is difficult, and plasma-processing an object to be processed, with the generated plasma, wherein the plasma is produced by pulsed discharge in which ON and OFF are repeated, radio-frequency power for producing the pulsed discharge, during an ON period, is a power to facilitate production of plasma by continuous discharge, and a duty ratio of the pulsed discharge is controlled so that an average power of the radio-frequency power per cycle is power in the region in which production of plasma by continuous discharge is difficult.

An average mass, an average density, and an average atomic number for a plurality of elements which form a specimen are calculated. A characteristic X-ray generation depth is calculated based on the average values and a minimum excitation energy of an element of interest. When an illumination condition is set, a reference image including a figure indicating a characteristic X-ray generation range, a numerical value indicating the characteristic X-ray generation depth, or the like, is displayed.

A pulsed direct current sputtering system and method are disclosed. The system has a plasma chamber with two targets, two magnetrons and one anode, a first power source, and a second power source. The first power source is coupled to the first magnetron and the anode, and provides a cyclic first-power-source voltage with a positive potential and a negative potential during each cycle between the anode and the first magnetron. The second power source is coupled to the second magnetron and the anode, and provides a cyclic second-power-source voltage. The controller phase-synchronizes and controls the first-power-source voltage and second-power-source voltage to apply a combined anode voltage, and phase-synchronizes a first magnetron voltage with a second magnetron voltage, wherein the combined anode voltage applied to the anode has a magnitude of at least 80 percent of a magnitude of a sum of the first magnetron voltage and the second magnetron voltage.

In one embodiment, a charged particle beam drawing apparatus deflects a charged particle beam with a deflector to draw a pattern. The apparatus includes a storage unit that stores an approximate formula indicating a correspondence relationship between a settling time for a DAC amplifier that controls the deflector, and a position shift amount, from a design position, of a drawn position of each evaluation pattern drawn on a first substrate while the settling time and an amount of deflection by the deflector are changed, a shot position correction unit that creates a correction formula indicating a relationship between an amount of deflection and a shot position shift amount at the settling time, from the approximate formula and the settling time for the DAC amplifier based on an amount of deflection of a shot, obtains a position correction amount by using the amount of deflection of the shot and the correction formula, and corrects a shot position defined by the shot data based on the position correction amount, and a drawing unit that performs drawing by using the shot data with a corrected shot position.

A charged particle beam device includes a charged particle beam device main body, a computer configured to control the charged particle beam device main body, including a CPU and a DRAM, and including software for controlling the charged particle beam device main body, a monitoring unit configured to monitor a resource usage status in the computer, an allocation availability determination unit configured to determine whether or not a resource for executing processing required by the software is allocatable in the computer according to a monitoring result of the monitoring unit, and a notification unit configured to notify, when the determination of the allocation availability determination unit is negative, information indicating that the determination is negative.

A charged particle beam device according to the present invention comprises a charged particle source that emits charged particles, a detection circuit that detects electrons which are generated by a sample as a result of irradiation with the charged particles, and a power storage device (107_VHD) that holds direct voltage, and comprises a charge circuit (107_CHG) that charges the power storage device with supplied voltage, and a control circuit (107_CTL) that controls the charge circuit such that charging is carried out in a period in which no sample is measured, wherein the direct voltage held by the power storage device (107_VHD) is used as operating voltage.