H01J2237/3146

Ion beam sample preparation and coating apparatus and methods

Disclosed are embodiments of an ion beam sample preparation and coating apparatus and methods. A sample may be prepared in one or more ion beams and then a coating may be sputtered onto the prepared sample within the same apparatus. A vacuum transfer device may be used with the apparatus in order to transfer a sample into and out of the apparatus while in a controlled environment. Various methods to improve preparation and coating uniformity are disclosed including: rotating the sample retention stage; modulating the sample retention stage; variable tilt ion beam irradiating means, more than one ion beam irradiating means, coating thickness monitoring, selective shielding of the sample, and modulating the coating donor holder.

Metal Plating of Grids for Ion Beam Sputtering
20200051783 · 2020-02-13 ·

Provided herein are deposition systems utilizing coated grids in an ion deposition process which provide more predictable erosion of the coating rather than erosion of the grid itself. Further, coatings may be utilized in which the coating material does not act as a contaminant to the deposition process, thereby eliminating contamination of the sample surface due to deposition of unwanted grid material. Also provided are methods of refurbishing a coated grid by periodically replacing the coating material thus protecting the grid itself and allowing a grid to be used indefinitely.

POWER POLISHING APPARATUSES AND METHODS FOR IN-SITU FINISHING AND COATING OF OPTICAL COMPONENT
20200001423 · 2020-01-02 · ·

A finishing and coating apparatus is configured for power polishing optical components. The apparatus includes a housing, a substrate holder, a vacuum pump system, a laser, and a coating source. The housing defines a chamber and the substrate holder is disposed within the chamber and configured to hold one or more optical components. The vacuum pump system is configured to create a vacuum within the chamber. The laser includes a laser engine and a laser beam delivery apparatus configured to direct a beam from the laser engine toward the one or more optical components. The laser is configured to finish the one or more optical components prior to coating the one or more optical components.

ION BEAM DEPOSITION APPARATUS AND ION BEAM DEPOSITION METHOD USING THE SAME

An ion beam deposition method includes placing a substrate into an ion beam deposition apparatus, irradiating an ion beam from an ion beam source toward a target plate, and rotating the target plate during the irradiating of the ion beam. The target plate includes a first region that includes a first material, and a second region that includes a second material different from the first material.

POWER POLISHING APPARATUSES AND METHODS FOR IN-SITU FINISHING AND COATING OF OPTICAL COMPONENT
20240167150 · 2024-05-23 · ·

A finishing and coating apparatus combines finishing and coating optical components into one vacuum apparatus. The apparatus includes a vacuum system, a substrate holder, a finisher including a laser engine and a beam delivery apparatus, and a coating source. The finisher is configured to finish the optical components prior to coating the optical components. The finisher includes a laser engine and a laser beam delivery apparatus configured to direct a beam from the laser engine toward each of the optical components.

Formation of an alignment film for a liquid crystal on a substrate

A method for forming an alignment film for a liquid crystal on a substrate and an associated at least one structure. The substrate is moved in a first direction. A target is disposed on the first surface side of the substrate. The ion beam is propagated from an ion source toward the substrate and impinges on a sputtering surface of the target, which sputters a material of the target and results in sputtered particles of the material being emitted from the sputtering surface of the target and deposited on the first surface side of the substrate to form (i) a sputtering film on the first surface side of the substrate and (ii) an alignment film having an orientation and being disposed on the sputtering film and on the entire surface of the substrate. The alignment film aligns molecules of the liquid crystal in a predetermined direction.

Single beam plasma source

A single beam plasma or ion source apparatus, including multiple and different power sources, is provided. An aspect of the present apparatus and method employs simultaneous excitation of an ion source by DC and AC, or DC and RF power supplies. Another aspect employs an ion source including multiple magnets and magnetic shunts arranged in a generally E cross-sectional shape.

Ion beam sputtering apparatus and method

An aspect of the invention provides an ion beam sputtering apparatus comprising an ion source configured to generate a hollow ion beam along a beam axis that is located in a hollow part of the beam; and a sputtering target having a target body that defines at least one target surface, the target body comprising sputterable particles, the target body being located relative to the ion source so that the ion beam hits the at least one target surface to sputter particles from the target body towards a surface of an object to be modified. The target body is shaped so that the particles sputtered towards a surface to be modified are generally sputtered from the sputtering target in radially extending sputter directions relative to the beam axis, the sputter directions being one of (i) directions extending towards the beam axis and (ii) directions extending away from the beam axis.

ION BEAM SPUTTERING APPARATUS AND METHOD

An aspect of the invention provides an ion beam sputtering apparatus comprising an ion source configured to generate a hollow ion beam along a beam axis that is located in a hollow part of the beam; and a sputtering target having a target body that defines at least one target surface, the target body comprising sputterable particles, the target body being located relative to the ion source so that the ion beam hits the at least one target surface to sputter particles from the target body towards a surface of an object to be modified. The target body is shaped so that the particles sputtered towards a surface to be modified are generally sputtered from the sputtering target in radially extending sputter directions relative to the beam axis, the sputter directions being one of (i) directions extending towards the beam axis and (ii) directions extending away from the beam axis.