The disclosure relates to a photolithography method based on electronic beam. The method includes: providing an electronic beam; making the electron beam transmit a two dimensional nanomaterial to form a transmission electron beam and a number of diffraction electron beams; shielding the transmission electron beam; and radiating a surface of an object by the plurality of diffraction electron beams. The photolithography method is high efficiency and has low cost.

The disclosure relates to a photolithography method based on electronic beam. The method includes: providing an electronic beam; making the electron beam transmit a two dimensional nanomaterial to form a transmission electron beam and a number of diffraction electron beams; shielding the transmission electron beam; and radiating a surface of an object by the plurality of diffraction electron beams. The photolithography method is high efficiency and has low cost.

In a method for forming a resist film, a first resist film is formed on a light shielding film formed on a substrate, by using a spin coating method. A protective film is formed on the first resist film. The protective film and the first resist film are simultaneously removed at the same region to expose a portion of the light shielding film. A first region in which the second resist film is formed on the light shielding film and a second region in which the second resist film is formed on the first resist film through the protective film, are provided. The protective film and the second resist film are simultaneously removed in the second region to expose the first resist film. A region in which the first resist film, and a region in which the second resist film, is formed, are separately provided on the substrate.