Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.

Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.

Forming an electrode structure includes forming a first cavity and a second cavity in a first hard mask layer, filling the first cavity and the second cavity with an electrically conductive material to form a first electrically conductive pillar and a second electrically conductive pillar; and planarizing exposed surfaces of the first and second electrically conductive pillars. Thereafter, a second hard mask layer is disposed on the first hard mask layer, a third cavity is formed passing through the second hard mask layer, and a second electroplating and planarization process fills the third cavity with the electrically conductive material to form a third electrically conductive pillar contacting the second electrically conductive pillar. A first electrode comprises the first electrically conductive pillar, and a second electrode comprises a combination of the second and third electrically conductive pillars.