An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.

An electromagnetic radiation detector includes an inlet window intended to receive a stream of incident photons, as well as a photocathode in the form of a semiconductive layer. A conductive layer is deposited on the downstream face of the inlet window and a thin dielectric layer is disposed between the conductive layer and the semiconductive layer. The conductive layer is brought to a potential below that of the semiconductive layer so as to drive the photoelectrons out of the recombination zone and consequently improve the quantum yield of the photocathode.

An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.

An image sensor has a photocathode window assembly, an anode assembly, and a malleable metal seal. The photocathode window assembly has a photocathode layer. The anode assembly includes a silicon substrate that has an electron sensitive surface. The malleable metal seal bonds the photocathode window assembly and the silicon substrate to each other. A vacuum gap separates the photocathode layer from the electron sensitive surface. A first electrical connection and a second electrical connection are for a voltage bias of the photocathode layer relative to the electron sensitive surface.

An apparatus and method are provided for a night vision system that integrates functions of detecting an intensified image and transmitting the intensified image superimposed with a heads-up display. The night vision system includes an optical device having a transparent display configured with pixels emitting display light (i.e., the heads-up display), and the transparent display has transmission regions arranged among the pixels for transmitting light representing an intensified image (e.g., luminescent light from a phosphor screen). Light rays passing through the transmission regions also pass through detectors, which detect light outside of the visible spectrum (e.g., UV light). By detecting light outside of the visible spectrum, the detectors detect the intensified image without degrading the image in the visible spectrum that is provided to users.

An electromagnetic radiation detector includes an inlet window intended to receive a stream of incident photons, as well as a photocathode in the form of a semiconductive layer. A conductive layer is deposited on the downstream face of the inlet window and a thin dielectric layer is disposed between the conductive layer and the semiconductive layer. The conductive layer is brought to a potential below that of the semiconductive layer so as to drive the photoelectrons out of the recombination zone and consequently improve the quantum yield of the photocathode.

A method of manufacturing a multi-layer image intensifier wafer includes fabricating first and second glass wafers, each having an array of cavities that extend between respective openings in first and second surfaces of the respective glass wafer; doping a semiconductor wafer to generate a plurality of electrons for each electron that impinges a first surface of the semiconductor wafer and to direct the plurality of electrons to a second surface of the semiconductor wafer, bonding a photo-cathode wafer to the first glass wafer; bonding the semiconductor wafer between the first and second glass wafers, and bonding the second glass wafer between the semiconductor wafer and an anode wafer (e.g., a phosphor screen or other electron detector). A section of the multi-layer image intensifier wafer may be sliced and evacuated to provide a multi-layer image intensifier.

Image intensifiers may include a photocathode that emits photoelectrons in proportion to the rate photons impact the photocathode. The photoelectrons are multiplied using a microchannel plate that includes a plurality of microchannels. Photoelectrons are scattered by the microchannel plate when the photoelectrons strike the surface of the microchannel plate rather than enter one of the microchannels. Electron scatter within an image intensifier results in a halo or bloom around bright or luminous objects. Halo or bloom may be minimized by reducing the electron scatter within the image intensifier. Deposition of an anti-scattering layer on the surface of the microchannel plate within the image intensifier can absorb photoelectrons that fail to enter a microchannel and may thus reduce the incidence of halo or bloom.

The present invention improves sensitivity of the ultraviolet band of a photoelectric surface. A photoelectric surface includes a window material that transmits ultraviolet rays, a conductive film that is formed on the window material and has conductivity, an intermediate film 4 that is formed on the conductive film and is formed of MgF.sub.2, and a photoelectric conversion film that is formed on the intermediate film 4 and is formed of CsTe. Since the photoelectric surface includes the intermediate film 4 formed of MgF.sub.2, the sensitivity of the ultraviolet band is improved.

A light intensifier includes a semiconductor structure to multiply electrons and block stray particles (e.g., photons and/or ions). The semiconductor structure includes an electron multiplier region that is doped to generate a plurality of electrons for each electron that impinges a reception surface of the semiconductor structure, blocking regions that are doped to direct the plurality of electrons towards emissions areas of an emission surface of the semiconductor structure, and shielding regions that are doped to absorb stray particles that impinge the emission surface of the semiconductor structure.