Patent classifications
H01J37/04
Fill pattern to enhance ebeam process margin
Lithographic apparatuses suitable for complementary e-beam lithography (CEBL) are described. In an example, a method of forming a pattern for a semiconductor structure includes forming a pattern of parallel lines above a substrate. The method also includes aligning the substrate in an e-beam tool to provide the pattern of parallel lines parallel with a scan direction of the e-beam tool. The e-beam tool includes a column having a blanker aperture array (BAA) with a staggered pair of columns of openings along an array direction orthogonal to the scan direction. The method also includes forming a pattern of cuts or vias in or above the pattern of parallel lines to provide line breaks for the pattern of parallel lines by scanning the substrate along the scan direction. A cumulative current through the column has a non-zero and substantially uniform cumulative current value throughout the scanning.
Charged particle source module
The disclosed embodiments relate to a charged particle source module for generating and emitting a charged particle beam, such as an electron beam, comprising: a frame including a first frame part, a second frame part, and one or more rigid support members which are arranged between said first frame part and said second frame part; a charged particle source arrangement for generating a charged particle beam, such as an electron beam, wherein said charged particle source arrangement, such as an electron source, is arranged at said second frame part; and a power connecting assembly arranged at said first frame part, wherein said charged particle source arrangement is electrically connected to said connecting assembly via electrical wiring.
Charged particle source module
The disclosed embodiments relate to a charged particle source module for generating and emitting a charged particle beam, such as an electron beam, comprising: a frame including a first frame part, a second frame part, and one or more rigid support members which are arranged between said first frame part and said second frame part; a charged particle source arrangement for generating a charged particle beam, such as an electron beam, wherein said charged particle source arrangement, such as an electron source, is arranged at said second frame part; and a power connecting assembly arranged at said first frame part, wherein said charged particle source arrangement is electrically connected to said connecting assembly via electrical wiring.
CHARGED PARTICLE BEAM DEVICE
Provided is a charged particle beam device with low blanking noise and improved signal detection accuracy. As means therefor, a charged particle beam device is configured by: a stage where a sample is mountable; a charged particle gun performing charged particle emission to the sample; a voltage source; a first switching circuit to which a voltage is supplied from the voltage source; a second switching circuit having one end connected to a ground; a third switching circuit having one end connected to the ground; a fourth switching circuit to which a voltage is supplied from the voltage source; a first blanking electrode connected to the first switching circuit and the second switching circuit; a second blanking electrode facing the first blanking electrode and connected to the third switching circuit and the fourth switching circuit; and a control circuit controlling the first switching circuit, the second switching circuit, the third switching circuit, and the fourth switching circuit.
Time-gated detection, dual-layer SPAD-based electron detection
Electron beam modulation in response to optical pump pulses applied to a sample is measured using SPAD elements. Individual detection events are used to form histograms of numbers of events in time bins associated with pump pulse timing. The histograms can be produced at a SPAD array, simplifying data transfer. In some examples, two SPAD arrays are stacked and a coincidence circuit discriminates signal events from noise events by determining corresponding events are detected within a predetermined time window.
SYSTEM AND METHOD FOR REDUCING THE CHARGING EFFECT IN A TRANSMISSION ELECTRON MICROSCOPE SYSTEM
Systems and methods for reducing the buildup of charge during the investigation of samples using charged particle beams, according to the present disclosure include irradiating a first portion of a sample during a first time period, wherein the irradiating the first portion of the sample causes a gradual accumulation of net charge in the first portion of the sample, generating imaging data based on emissions resultant from irradiating the first portion of the sample, and then irradiating a second portion of a sample holder for a second time period. The methods may further includes iteratively repeating the irradiation of the first portion and the second portion during imaging of the sample region. When more than one region of interest on the sample is to be investigated, the method may also include continuing to image additional portions of the sample by iteratively irradiating a region of interest on the sample and a corresponding portion of the sample holder.
APERTURE BODY, FLOOD COLUMN AND CHARGED PARTICLE TOOL
Disclosed herein is an aperture body for passing a portion of a charged particle beam propagating along a beam path comprising an axis, the aperture body comprising: an up-beam facing surface; a chamber portion comprising an up-beam end, a down-beam end and an up-beam plate, wherein the up-beam plate extends radially inwards from the up-beam end and the up-beam plate is configured to define an entrance opening around the beam path; wherein: the up-beam facing surface extends radially inwards from the down-beam end; the up-beam facing surface comprises an aperture portion that is configured to define an opening around the beam path; and the opening defined by the aperture portion is smaller than the entrance opening.
ELECTRON DIFFRACTION HOLOGRAPHY
Methods for using electron diffraction holography to investigate a sample, according to the present disclosure include the initial steps of emitting a plurality of electrons toward the sample, forming the plurality of electrons into a first electron beam and a second electron beam, and modifying the focal properties of at least one of the two beams such that the two beams have different focal planes. Once the two beams have different focal planes, the methods include focusing the first electron beam such that it has a focal plane at or near the sample, and focusing the second electron beam so that it is incident on the sample, and has a focal plane in the diffraction plane. An interference pattern of the first electron beam and the diffracted second electron beam is then detected in the diffraction plane, and then used to generate a diffraction holograph.
ELECTRON DIFFRACTION HOLOGRAPHY
Methods for using electron diffraction holography to investigate a sample, according to the present disclosure include the initial steps of emitting a plurality of electrons toward the sample, forming the plurality of electrons into a first electron beam and a second electron beam, and modifying the focal properties of at least one of the two beams such that the two beams have different focal planes. Once the two beams have different focal planes, the methods include focusing the first electron beam such that it has a focal plane at or near the sample, and focusing the second electron beam so that it is incident on the sample, and has a focal plane in the diffraction plane. An interference pattern of the first electron beam and the diffracted second electron beam is then detected in the diffraction plane, and then used to generate a diffraction holograph.
Methods and apparatuses for adjusting beam condition of charged particles
Apparatus and methods for adjusting beam condition of charged particles are disclosed. According to certain embodiments, the apparatus includes one or more first multipole lenses displaced above an aperture, the one or more first multipole lenses being configured to adjust a beam current of a charged-particle beam passing through the aperture. The apparatus also includes one or more second multipole lenses displaced below the aperture, the one or more second multipole lenses being configured to adjust at least one of a spot size and a spot shape of the beam.