Provided is a sample loading method of loading a cooled sample into a sample exchange chamber of a charged particle beam apparatus includes: attaching the sample container in which a sample and liquid nitrogen are accommodated to the sample exchange chamber via a gate valve; evacuating a space between a liquid surface of the liquid nitrogen and the gate valve in a state in which the gate valve is closed; discharging the liquid nitrogen in the sample container after the space between the liquid surface of the liquid nitrogen and the gate valve has been evacuated; evacuating a space in the sample container after the liquid nitrogen in the sample container has been discharged; and opening the gate valve after the space in the sample container has been evacuated.

A coupling for connecting together vacuum-based analytical systems requiring to be vibrationally isolated, comprising: a tubular connector having a longitudinal axis, the connector comprising a first end for connection to a first analytical system and a flexible portion reducing transmission of vibrations and permitting displacement of the first analytical system in a direction transverse to the longitudinal axis of the connector; and a seal longitudinally separated from the flexible portion, for vacuum sealing between the connector and a second analytical system; wherein the connector contains ion optics for transmitting ions between the first and second analytical systems.

A substrate is held in a substrate holder and accommodated in a treatment chamber. A positive electrode panel is arranged opposite to a surface of the substrate. Process gas is sent from a blower panel, toward the positive electrode panel and the substrate. A positive electrode of a high-frequency power source is connected to the positive electrode panel, and a negative electrode of the high-frequency power source is connected to the blower panel, to apply a high-frequency voltage. The process gas passes between the positive electrode panel and the blower panel which is the negative electrode, so that plasma is generated. The generated plasma removes contaminants on the surface of the substrate.

A substrate is held in a substrate holder and accommodated in a treatment chamber. A positive electrode panel is arranged opposite to a surface of the substrate. Process gas is sent from a blower panel, toward the positive electrode panel and the substrate. A positive electrode of a high-frequency power source is connected to the positive electrode panel, and a negative electrode of the high-frequency power source is connected to the blower panel, to apply a high-frequency voltage. The process gas passes between the positive electrode panel and the blower panel which is the negative electrode, so that plasma is generated. The generated plasma removes contaminants on the surface of the substrate.

A light emitter is a light emitter for converting incident electrons into light, and includes a multiple quantum well structure for generating the light by incidence of the electrons, and an electron incident surface provided on the multiple quantum well structure. A certain barrier layer included in a plurality of barrier layers constituting the multiple quantum well structure is thicker than another barrier layer included in the plurality of barrier layers and located on the electron incident surface side with respect to the certain barrier layer.

A light emitter is a light emitter for converting incident electrons into light, and includes a multiple quantum well structure for generating the light by incidence of the electrons, and an electron incident surface provided on the multiple quantum well structure. A certain barrier layer included in a plurality of barrier layers constituting the multiple quantum well structure is thicker than another barrier layer included in the plurality of barrier layers and located on the electron incident surface side with respect to the certain barrier layer.

An electron beam source including a cathode, an anode, a means for deflecting an electron beam over a target surface and at least one vacuum pump, the electron beam source further including a contraction area arranged between the anode and the means for deflecting the electron beam where a hole in the contraction area is aligned with a hole in the anode with respect to the cathode, a first vacuum pump is arranged between the contraction area and the anode and a second vacuum pump is arranged above the anode, a gas inlet is provided between the contraction area and the means for deflecting the electron beam, wherein a first crossover of the electron beam is arranged between the cathode and the anode and a second crossover is arranged at or in close proximity to the contraction area.

An electron beam source including a cathode, an anode, a means for deflecting an electron beam over a target surface and at least one vacuum pump, the electron beam source further including a contraction area arranged between the anode and the means for deflecting the electron beam where a hole in the contraction area is aligned with a hole in the anode with respect to the cathode, a first vacuum pump is arranged between the contraction area and the anode and a second vacuum pump is arranged above the anode, a gas inlet is provided between the contraction area and the means for deflecting the electron beam, wherein a first crossover of the electron beam is arranged between the cathode and the anode and a second crossover is arranged at or in close proximity to the contraction area.

A sample attachment device includes a mount, a mounted depression, and a pressure release depression. Liquid and air bubbles can pass the pressure release depression. The mounted depression is on the mount. A cartridge is mounted on the mounted depression. The pressure release depression is in the mounted depression. The pressure release depression is vertically under the cartridge when the cartridge is mounted on the mounted depression.

A sample attachment device includes a mount, a mounted depression, and a pressure release depression. Liquid and air bubbles can pass the pressure release depression. The mounted depression is on the mount. A cartridge is mounted on the mounted depression. The pressure release depression is in the mounted depression. The pressure release depression is vertically under the cartridge when the cartridge is mounted on the mounted depression.