There are provided techniques for analyzing an atom probe tomography data set obtained from a tip-shaped sample. The techniques include defining analysis sub-volumes in the atom probe tomography data set; performing a fast Fourier transform (FFT) on each of the analysis sub-volumes to obtain a signal in a Fourier domain; identifying at least one FFT peak in the signal in the Fourier domain, each FFT peak being indicative of an expected crystal feature in the corresponding analysis sub-volume; continuously and automatically calculating an image compression factor and a radius of the tip-shaped sample, based on identified crystal features, the identified crystal features being obtained from a collection of expected crystal features; and reconstructing a three-dimensional model of the tip-shaped sample. Said reconstructing includes comparing the identified crystal features with calibration data; and dynamically adjusting the image compression factor and the radius of the tip-shaped sample.

A method for evaluating a specimen, the method can include positioning an energy dispersive X-ray (EDX) detector at a first position; scanning a flat surface of the specimen by a charged particle beam that exits from a charged particle beam optics tip and propagates through an aperture of an EDX detector tip; detecting, by the EDX detector, x-ray photons emitted from the flat surface as a result of the scanning of the flat surface with the charged particle beam; after a completion of the scanning of the flat surface, positioning the EDX detector at a second position in which a distance between the EDX detector tip and a plane of the flat surface exceeds a distance between the plane of the flat surface and the charged particle beam optics tip; and wherein a projection of the EDX detector on the plane of the flat surface virtually falls on the flat surface when the EDX detector is positioned at the first position and when the EDX detector is positioned at the second position.

A method for evaluating a specimen, the method can include positioning an energy dispersive X-ray (EDX) detector at a first position; scanning a flat surface of the specimen by a charged particle beam that exits from a charged particle beam optics tip and propagates through an aperture of an EDX detector tip; detecting, by the EDX detector, x-ray photons emitted from the flat surface as a result of the scanning of the flat surface with the charged particle beam; after a completion of the scanning of the flat surface, positioning the EDX detector at a second position in which a distance between the EDX detector tip and a plane of the flat surface exceeds a distance between the plane of the flat surface and the charged particle beam optics tip; and wherein a projection of the EDX detector on the plane of the flat surface virtually falls on the flat surface when the EDX detector is positioned at the first position and when the EDX detector is positioned at the second position.

Provided is an electron microscope for generating an observation image of a sample by using an electron beam in order to obtain a scanning electron microscope image by low angle backscattered electrons, which are backscattered electrons emitted at a low angle with respect to a sample surface, even for an electron microscope including an objective lens that leaks a magnetic field to a sample. The electron microscope includes: an electron source configured to irradiate the sample with the electron beam; an objective lens configured to focus the electron beam by a leakage magnetic field which is a magnetic field leaked toward the sample; a detector configured to detect a third electron which is an electron emitted when a low angle backscattered electron is caused to collide with the sample by the leakage magnetic field, the low angle backscattered electron being a backscattered electron emitted at a low angle with respect to a surface of the sample; and a compensation electrode or a compensation magnetic pole provided between the sample and the detector and configured to control a trajectory of the third electron.

Provided is an electron microscope for generating an observation image of a sample by using an electron beam in order to obtain a scanning electron microscope image by low angle backscattered electrons, which are backscattered electrons emitted at a low angle with respect to a sample surface, even for an electron microscope including an objective lens that leaks a magnetic field to a sample. The electron microscope includes: an electron source configured to irradiate the sample with the electron beam; an objective lens configured to focus the electron beam by a leakage magnetic field which is a magnetic field leaked toward the sample; a detector configured to detect a third electron which is an electron emitted when a low angle backscattered electron is caused to collide with the sample by the leakage magnetic field, the low angle backscattered electron being a backscattered electron emitted at a low angle with respect to a surface of the sample; and a compensation electrode or a compensation magnetic pole provided between the sample and the detector and configured to control a trajectory of the third electron.

A method includes capturing a photon emission microscope (PEM) image of an integrated circuit (IC), and identifying emission sites in the PEM image, where the emission sites are associated with a leakage current. A set of common nets is found that connects multiple emission sites using layout data and/or netlist data in computer-aided design (CAD) data. From the layout data and/or netlist data, a critical net is identified from the set of common nets connecting a threshold number of emission sites. The critical net is cross-mapped, by a processor, tip netlist data in the CAD data. A particular device is identified from the netlist data that has an output pin connected to the critical net. The particular device identified from the netlist data is cross-mapped, by a processor, to the layout data, wherein the critical net connects at least two devices at the identified emission sites including the particular device.

A method includes capturing a photon emission microscope (PEM) image of an integrated circuit (IC), and identifying emission sites in the PEM image, where the emission sites are associated with a leakage current. A set of common nets is found that connects multiple emission sites using layout data and/or netlist data in computer-aided design (CAD) data. From the layout data and/or netlist data, a critical net is identified from the set of common nets connecting a threshold number of emission sites. The critical net is cross-mapped, by a processor, tip netlist data in the CAD data. A particular device is identified from the netlist data that has an output pin connected to the critical net. The particular device identified from the netlist data is cross-mapped, by a processor, to the layout data, wherein the critical net connects at least two devices at the identified emission sites including the particular device.

Disclosed herein is a system for profiling holes in non-opaque samples. The system includes: (i) an e-beam source configured to project an e-beam into an inspection hole in a sample, such that a wall of the inspection hole is struck and a localized electron cloud is produced; (ii) a light sensing infrastructure configured to sense cathodoluminescent light, generated by the electron cloud; and (iii) a computational module configured to analyze the measured signal to obtain the probed depth at which the wall was struck. A lateral offset, and/or orientation, of the e-beam is controllable, so as to allow generating localized electron clouds at each of a plurality of depths inside the inspection hole, and thereby obtain information at least about a two-dimensional geometry of the inspection hole.

Disclosed herein is a system for profiling holes in non-opaque samples. The system includes: (i) an e-beam source configured to project an e-beam into an inspection hole in a sample, such that a wall of the inspection hole is struck and a localized electron cloud is produced; (ii) a light sensing infrastructure configured to sense cathodoluminescent light, generated by the electron cloud; and (iii) a computational module configured to analyze the measured signal to obtain the probed depth at which the wall was struck. A lateral offset, and/or orientation, of the e-beam is controllable, so as to allow generating localized electron clouds at each of a plurality of depths inside the inspection hole, and thereby obtain information at least about a two-dimensional geometry of the inspection hole.

According to one aspect of the present invention, a multi-beam image acquisition apparatus, includes: an objective lens configured to image multiple primary electron beams on a substrate by using the multiple primary electron beams; a separator configured to have two or more electrodes for forming an electric field and two or more magnetic poles for forming a magnetic field and configured to separate multiple secondary electron beams emitted due to the substrate being irradiated with the multiple primary electron beams from trajectories of the multiple primary electron beams by the electric field and the magnetic field formed; a deflector configured to deflect the multiple secondary electron beams separated; a lens arranged between the objective lens and the deflector and configured to image the multiple secondary electron beams at a deflection point of the deflector; and a detector configured to detect the deflected multiple secondary electron beams.