Embodiments include a vacuum device, comprising: an enclosure configured to enclose a vacuum, comprising an external base forming at least a portion of the enclosure; an internal base within the enclosure; and at least one thermal dissipative strap assembly, comprising: an internal base thermal conductive base in contact with the internal base, an external base thermal conductive base in contact with the external base, and a flexible thermal dissipative strap coupling the internal base thermal conductive base to the external base thermal conductive base.

Embodiments include a vacuum device, comprising: an enclosure configured to enclose a vacuum, the enclosure including an external base including an opening; an internal base within the enclosure; and an adjustable support assembly adjustably coupling the internal base to the external base and extending through the opening, the adjustable support assembly comprising: a threaded shaft extending along a longitudinal axis and coupled to the internal base; a threaded hole component threadedly engaged with the threaded shaft and coupled to the external base such that the threaded hole component is axially constrained in a direction along the longitudinal axis relative to the external base independent of the threaded shaft; and a flexible component coupled to the external base and the threaded shaft and sealing the opening.

Embodiments include a vacuum device, comprising: an enclosure configured to enclose a vacuum, comprising an external base forming at least a portion of the enclosure; an internal base within the enclosure; and at least one thermal dissipative strap assembly, comprising: an internal base thermal conductive base in contact with the internal base, an external base thermal conductive base in contact with the external base, and a flexible thermal dissipative strap coupling the internal base thermal conductive base to the external base thermal conductive base.

Embodiments include a vacuum device, comprising: an enclosure configured to enclose a vacuum, the enclosure including an external base including an opening; an internal base within the enclosure; and an adjustable support assembly adjustably coupling the internal base to the external base and extending through the opening, the adjustable support assembly comprising: a threaded shaft extending along a longitudinal axis and coupled to the internal base; a threaded hole component threadedly engaged with the threaded shaft and coupled to the external base such that the threaded hole component is axially constrained in a direction along the longitudinal axis relative to the external base independent of the threaded shaft; and a flexible component coupled to the external base and the threaded shaft and sealing the opening.

In joining composite ceramic bodies, at least one ceramic body is a compositionally graded with varying concentrations between two or more ceramic materials. The compositionally graded ceramic body terminates at an interfacial layer that is substantially composed of a single ceramic material. The compositionally graded ceramic body is joined to another ceramic body that may also be compositionally graded or made of a single ceramic material, and an interfacial layer of the other ceramic body is identical in composition with the interfacial layer of the compositionally graded ceramic body. In some embodiments, the ceramic bodies may be joined by diffusion bonding. In some embodiments, the ceramic bodies include a ceramic platen and ceramic stem of a wafer pedestal implemented in a plasma processing apparatus.

In joining composite ceramic bodies, at least one ceramic body is a compositionally graded with varying concentrations between two or more ceramic materials. The compositionally graded ceramic body terminates at an interfacial layer that is substantially composed of a single ceramic material. The compositionally graded ceramic body is joined to another ceramic body that may also be compositionally graded or made of a single ceramic material, and an interfacial layer of the other ceramic body is identical in composition with the interfacial layer of the compositionally graded ceramic body. In some embodiments, the ceramic bodies may be joined by diffusion bonding. In some embodiments, the ceramic bodies include a ceramic platen and ceramic stem of a wafer pedestal implemented in a plasma processing apparatus.

A gas inlet suitable in particular for use in an ion thruster includes a housing which is made of a gas-tight ceramics material, and an insert which is arranged in the housing and is made of a porous ceramics material. The geometry and pore structure of the insert are such that the insert forms a desired flow resistance for a gas stream flowing through the insert.

A gas inlet suitable in particular for use in an ion thruster includes a housing which is made of a gas-tight ceramics material, and an insert which is arranged in the housing and is made of a porous ceramics material. The geometry and pore structure of the insert are such that the insert forms a desired flow resistance for a gas stream flowing through the insert.

A processor controlled induction RF fluorescent lamp, where the control processor runs a load control algorithm at least for switching the electrical load for connection to an external dimming device, the lamp comprising a vitreous envelope filled with an ionizable gas mixture; a power coupler comprising at least one winding of an electrical conductor; and an electronic ballast providing appropriate voltage and current to the power coupler.

A processor controlled induction RF fluorescent lamp, where the control processor runs a load control algorithm at least for switching the electrical load for connection to an external dimming device, the lamp comprising a vitreous envelope filled with an ionizable gas mixture; a power coupler comprising at least one winding of an electrical conductor; and an electronic ballast providing appropriate voltage and current to the power coupler.