A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

We disclose herein an infra-red (IR) device comprising a substrate comprising an etched cavity portion and a substrate portion; a dielectric layer disposed on the substrate. The dielectric layer comprises a dielectric membrane which is adjacent, or directly above, or below the etched cavity portion of the substrate. The device further comprises a reflective layer on or in or above or below the dielectric membrane to enhance emission or absorption of infrared light at one or more wavelengths.

We disclose herein an infra-red (IR) device comprising a substrate comprising an etched cavity portion and a substrate portion; a dielectric layer disposed on the substrate. The dielectric layer comprises a dielectric membrane which is adjacent, or directly above, or below the etched cavity portion of the substrate. The device further comprises a reflective layer on or in or above or below the dielectric membrane to enhance emission or absorption of infrared light at one or more wavelengths.

Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.

In one embodiment, a permanent magnet includes: a composition expressed by R.sub.pFe.sub.qM.sub.rCu.sub.sCo.sub.100-p-q-r-s (R is a rare-earth element, M is at least one element selected from Zr, Ti, and Hf, 10p13.5 at %, 25q40 at %, 1.35r1.75 at %, and 0.88s13.5 at %); and a metallic structure including Th.sub.2Zn.sub.17 crystal phases each having a Fe concentration of 25 at % or more, and Cu-rich crystal phases each having a Cu concentration of from 25 at % to 70 at %. An average thickness of the Cu-rich crystal phases is 20 nm or less, and an average distance between the Cu-rich crystal phases is 200 nm or less.

High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 m or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 m or less thickness.

A light emitting device includes a light emitting element with first and second electrodes formed on the same surface side; a base with first and second conductive members, each including a wide part facing the an electrode and a narrow part extending away from the wide part; first and second bonding members each electrically connecting a corresponding electrode with a conductive member, and continuously covering the wide and narrow parts of a corresponding conductive member; and one or more light reflecting members at least partially covering the conductive members.

(1) A conductor layer is disposed on at least one surface of a dielectric layer, the dielectric layer including an intermediate layer and a pair or more of fluororesin layers disposed on both surfaces of the intermediate layer, in which the ratio of the total average thickness of the intermediate layer to the total average thickness of the fluororesin layers is 0.001 to 30, the relative dielectric constant of the intermediate layer is 1.2 to 10, the coefficient of linear expansion of the intermediate layer is 110.sup.4/ C. to 510.sup.5/ C., and the adhesive strength between the fluororesin layer and the conductor layer is 300 g/cm or more. (2) Conductor layers are disposed on both surfaces of a dielectric layer made of a fluororesin, in which at least one of the conductor layers constitutes a wiring pattern, the average trace width of the wiring pattern is 25 to 300 m, the average thickness of the dielectric layer in the region where traces of the wiring pattern are disposed is 5 to 125 m, and the ratio of the average trace width to the average thickness of the dielectric layer is 2.4 to 30. (3) A multilayer structure includes conductor layers and dielectric layers made of a fluororesin alternately disposed, in which the fluororesin of the dielectric layers is crosslinked and chemically bonded to the conductor layers, the average thickness of the multilayer structure is 30 to 2,000 m, and the crush resistance of the multilayer structure measured by a loop stiffness test is 0.1 to 20,000 N/cm.

We disclose herein an infra-red (IR) device comprising a substrate comprising an etched cavity portion and a substrate portion; a dielectric layer disposed on the substrate. The dielectric layer comprises a dielectric membrane which is adjacent, or directly above, or below the etched cavity portion of the substrate. The device further comprises a reflective layer on or in or above or below the dielectric membrane to enhance emission or absorption of infrared light at one or more wavelengths.