A generator control unit (GCU) having thermal control includes a GCU housing having a first side and a second side. A printed wiring board (PWB) is within the GCU housing between the first side and the second side. The PWB includes a component side that faces a first side of the GCU housing. At least one through via is positioned through a thickness of the PWB. At least one boss is positioned on the component side of the PWB. The at least one boss extends from a component of the PWB to the first side of the GCU housing.

An electronic device according to various embodiments may include a housing, an antenna structure positioned in the housing, and a wireless communication circuit. The antenna structure may include a first conductive layer including a first opening, a second conductive layer positioned in parallel with the first conductive layer, and including a second opening which overlaps at least in part with the first opening when the first conductive layer is seen from above, a third conductive layer positioned in parallel with the first conductive layer and interposed between the first conductive layer and the second conductive layer, a first insulating layer interposed between the first conductive layer and the third conductive layer, a second insulating layer interposed between the second conductive layer and the third conductive layer, a first conductive plate electrically separated from the first conductive layer and disposed within the first opening, a second conductive plate electrically separated from the second conductive layer and disposed within the second opening, a first conductive via electrically coupled between the first conductive plate and the third conductive layer through the first insulating layer, and a second conductive via electrically coupled between the second conductive plate and the third conductive layer through the second insulating layer. The wireless communication circuit may be configured to transmit or receive a signal having a frequency between 3 Giga Hertz (GHz) and 100 GHz and is electrically coupled to the antenna structure. Various embodiments may be possible.

An LED bulb structure includes a glass envelope, support, LED light emitting body, tungsten filament light emitting body and electronic element units, where the glass envelope is vacuum-sealed, the support formed by a conducting wire is fixed inside it, both LED and tungsten filament light emitting bodies are configured on the support, the necessary electronic element units are configured on the support between the LED light emitting body and tungsten filament light emitting body, and one side of the support is set to a positive pole and another side thereof a negative pole. As arranged, air will enter the glass envelope of a broken LED bulb to cause the tungsten filament to be burned to break to extinguish, and thus to cause the LED light emitting body to extinguish in such a way to remind users that the broken LED bulb must be replaced with a new one.

Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.

An energy storage module includes a plurality of energy storage devices electrically connected together in series; and a plurality of electronics boards distributed across the module, in electrical contact with one or more of the energy storage devices. The module further includes a plurality of flexible printed circuit boards whereby each of the plurality of electronics boards are electrically connected together in series with a neighboring one of the plurality of electronics boards by a different one of the flexible printed circuit boards. For each electronics board and for each flexible printed circuit board, a ground plane is provided, whereby the ground planes provide electrical grounding at substantially the same potential across all the electronics boards and all the flexible printed circuit boards.

In replacing stock headlights on certain trucks with new Light Emitting Diode (LED) lights, the onboard diagnostic system of the trucks do not read sufficient load resistance from the new lights and so the diagnostic system indicates that there is an issue with the lighting system and consequently limits the functionality of the lighting system. The present application seeks to provide a solution to this problem by creating a headlight adapter that integrates components for imitating the load resistance and switching functions of Original Equipment Manufacturer (OEM) truck headlights (the “Headlight Adapter ”).

In replacing stock headlights on certain trucks with new Light Emitting Diode (LED) lights, the onboard diagnostic system of the trucks do not read sufficient load resistance from the new lights and so the diagnostic system indicates that there is an issue with the lighting system and consequently limits the functionality of the lighting system. The present application seeks to provide a solution to this problem by creating a headlight adapter that integrates components for imitating the load resistance and switching functions of Original Equipment Manufacturer (OEM) truck headlights (the “Headlight Adapter ”).

A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.

A device may include a temperature controlled chamber. The temperature controlled chamber may be coupled to a plurality of strengthening coated capillary tubes. The strengthening coated capillary tubes may support the temperature controlled chamber and provide thermal insulation to the temperature controlled chamber.

The present invention aims to provide a novel magnet, whose surface's insulating property can be increased, and a motor using the same. The present invention provides a magnet comprising a magnet element containing a rare earth element R, a transition metal element T and boron B, and a phosphate layer including manganese-containing phosphate, wherein the phosphate layer is provided on the surface of the magnet element, and the thickness of the phosphate layer is 0.5 m or more.