A high temperature heater lamp including a ceramic envelope is disclosed. The ceramic envelope is substantially infrared transparent and is composed of a refractory ceramic. The heater lamp also includes two lead wires communicatively coupled via a filament. The filament is enclosed within the ceramic envelope, which is evacuated. The heater lamp may include at least two metallic IR shields within the ceramic envelope, at least one located on either side of the filament. The filament may be tungsten, a carbon filament, or molybdenum. At least one end of the ceramic envelope may be sealed with a metal cap affixed to the ceramic envelope by a high vacuum sealant. The heater lamp may be configured to operate at above 1500° C. The ceramic envelope may have a wall thickness less than 1 mm thick.

A high temperature heater lamp including a ceramic envelope is disclosed. The ceramic envelope is substantially infrared transparent and is composed of a refractory ceramic. The heater lamp also includes two lead wires communicatively coupled via a filament. The filament is enclosed within the ceramic envelope, which is evacuated. The heater lamp may include at least two metallic IR shields within the ceramic envelope, at least one located on either side of the filament. The filament may be tungsten, a carbon filament, or molybdenum. At least one end of the ceramic envelope may be sealed with a metal cap affixed to the ceramic envelope by a high vacuum sealant. The heater lamp may be configured to operate at above 1500° C. The ceramic envelope may have a wall thickness less than 1 mm thick.

An incandescent lamp is provided which prevents disconnection of a coupling part between a filament and a lead wire and also which improves impact resistance. A lead wire 4 has, in a standing portion 11 inside of a bulb 2, a first zone 19a to a third zone 19c in order from a top. The third zone 19c further penetrates through a pinch seal part 3 while firmly fixed thereto. The first zone 19a and the second zone 19b are formed of materials consisting primarily of molybdenum and nickel, respectively. The third zone 19c is formed of a Dumet wire 29.

An incandescent lamp is provided which prevents disconnection of a coupling part between a filament and a lead wire and also which improves impact resistance. A lead wire 4 has, in a standing portion 11 inside of a bulb 2, a first zone 19a to a third zone 19c in order from a top. The third zone 19c further penetrates through a pinch seal part 3 while firmly fixed thereto. The first zone 19a and the second zone 19b are formed of materials consisting primarily of molybdenum and nickel, respectively. The third zone 19c is formed of a Dumet wire 29.

A lamp (10) is formed of a lamp capsule (1) sealed with a press seal (2) penetrated by electrical lead-ins (12), the lamp (1) being received in an insulating base (16) that has external electrical pins (18). Power leads (20) interconnect respective capsule lead-ins (12) and base pins (18). Power leads (20) are formed of stranded wire having a plurality of intertwined strands.

A lamp (10) is formed of a lamp capsule (1) sealed with a press seal (2) penetrated by electrical lead-ins (12), the lamp (1) being received in an insulating base (16) that has external electrical pins (18). Power leads (20) interconnect respective capsule lead-ins (12) and base pins (18). Power leads (20) are formed of stranded wire having a plurality of intertwined strands.

Embodiments of the present invention generally relate to simplified, high voltage, tungsten halogen lamps for use as source of heat radiation in a rapid thermal processing (RTP) chamber or other lamp heated thermal processing chambers. Embodiments include a lamp design that includes an external fuse while reducing the number of part and expense of prior art lamps. In addition, embodiments of the lamps described herein provide sufficient rigidity to handle compressive forces of inserting the lamps into a heating assembly base, while maintaining a simplified fuse design.

Embodiments of the present invention generally relate to simplified, high voltage, tungsten halogen lamps for use as source of heat radiation in a rapid thermal processing (RTP) chamber or other lamp heated thermal processing chambers. Embodiments include a lamp design that includes an external fuse while reducing the number of part and expense of prior art lamps. In addition, embodiments of the lamps described herein provide sufficient rigidity to handle compressive forces of inserting the lamps into a heating assembly base, while maintaining a simplified fuse design.

A high temperature heater lamp including a ceramic envelope is disclosed. The ceramic envelope is substantially infrared transparent and is composed of a refractory ceramic. The heater lamp also includes two lead wires communicatively coupled via a filament. The filament is enclosed within the ceramic envelope, which is evacuated. The heater lamp may include at least two metallic IR shields within the ceramic envelope, at least one located on either side of the filament. The filament may be tungsten, a carbon filament, or molybdenum. At least one end of the ceramic envelope may be sealed with a metal cap affixed to the ceramic envelope by a high vacuum sealant. The heater lamp may be configured to operate at above 1500° C. The ceramic envelope may have a wall thickness less than 1 mm thick.

A high temperature heater lamp including a ceramic envelope is disclosed. The ceramic envelope is substantially infrared transparent and is composed of a refractory ceramic. The heater lamp also includes two lead wires communicatively coupled via a filament. The filament is enclosed within the ceramic envelope, which is evacuated. The heater lamp may include at least two metallic IR shields within the ceramic envelope, at least one located on either side of the filament. The filament may be tungsten, a carbon filament, or molybdenum. At least one end of the ceramic envelope may be sealed with a metal cap affixed to the ceramic envelope by a high vacuum sealant. The heater lamp may be configured to operate at above 1500° C. The ceramic envelope may have a wall thickness less than 1 mm thick.