Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

A manufacturing method for circuit board on copper ceramic substrate comprises stamping a copper sheet into a copper circuit board in a shape matching a ceramic substrate, fitting the copper circuit board to the ceramic substrate and sintering the copper circuit board and the ceramic substrate together by direct bonding copper.

A method of manufacturing a ceramic substrate includes the steps of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of a glass ceramic, applying the ceramic paste to a green sheet which is to become a ceramic layer after firing, applying a conductor paste which is to become a conductor trace after firing to the ceramic paste having been applied to the green sheet, and firing the green sheet carrying the ceramic paste and the conductor paste applied thereto.

A method of manufacturing a brake pedal coil printed circuit board is provided. The method comprises preparing a first epoxy layer having first copper foil laminated on both surfaces thereof; laminating each of second epoxy layers on the first copper foil, and laminating second copper foil on each of the second epoxy layers; forming a through hole, performing electroless copper plating on an inside surface of the through hole and the second copper foil, and forming an electrolytic copper-plated layer on each of the electroless copper-plated layer; forming circuits having a predetermined pattern on the electrolytic copper-plated layer and the electroless copper-plated layer and forming a gap between the circuits; applying a PSR ink onto the electrolytic copper-plated layer; applying a marking ink onto the PSR ink; forming a Ni-plated layer around the through hole and the hole land; and forming an Au-plated layer on the Ni-plated layer.