An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The chip package has a first side facing the thermal management device and a second side mounted to a first side of the PCB. The bracket is disposed on a second side of the PCB that faces away from the chip package. The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.

A heat sink structure includes a heat sink; a threaded heat sink base pocket within the heat sink; a module lid, where the module lid thermally interfaces with a die; a threaded exterior portion of the module lid; and a thread engagement between the threaded heat sink base pocket and the threaded exterior portion of the module lid, where the thread engagement mechanically couples the heat sink to the module lid.

A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.

An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.

A base of a connector defines an accommodation portion for accommodating a card-type device. The base has holding portions with surfaces directed to the accommodation portion. The holding portions hold held portions of terminals 40. Heat conductive members are provided on the surfaces of the holding portions. The heat conductive members are sandwiched between the card-type device and the holding portions when the card-type device is connected to the connector 10. In this way, heat conductive paths, which include the conductive members, are formed between the card-type device and held portions of the terminals 40.

A multi-layer thermal interface material including two or more thermal interface materials laminated together, where each of the two or more thermal interface materials comprise different mechanical properties.

A base of a connector defines an accommodation portion for accommodating a card-type device. The base has holding portions with surfaces directed to the accommodation portion. The holding portions hold held portions of terminals 40. Heat conductive members are provided on the surfaces of the holding portions. The heat conductive members are sandwiched between the card-type device and the holding portions when the card-type device is connected to the connector 10. In this way, heat conductive paths, which include the conductive members, are formed between the card-type device and held portions of the terminals 40.

An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.