A method for filling a through hole with solder includes mounting a substrate having a through hole formed therein on a permeable barrier layer having pores that enable gas to flow through the permeable barrier. A solder source is positioned over the through hole. Molten solder is delivered in the through hole with a positive pressure from the solder source such that gas in the through holes passes the permeable barrier while the molten solder remains in the through hole.

A positioning mask includes a body delimiting conduits dimensioned to each accommodate a single functional electronic object and opening through a first opening on a cooperation face, and through a second opening on a reception face.

A system for manufacturing an optoelectronic device includes functional electronic objects distributed and fixed on a reception face of a screen substrate.

The system further includes a positioning mask of the aforementioned type as well as a supplying unit for freely depositing an assembly of functional electronic objects on the reception face, and a placing unit for positioning the cooperation face facing the reception face, the conduits being arranged at predetermined locations on the reception face where the functional electronic objects are positioned. A a method for manufacturing an optoelectronic device is also related.

An electronic apparatus includes: an electronic module; a display panel disposed on the electronic module and including a first display region and a second display region adjacent to the first display region, the second display region overlapping the electronic module; and a polarization plate disposed on the display panel and including a first polarization region overlapping the first display region and a second polarization region including a polarization part and a non-polarization part having higher light transmittance than the polarization part, the non-polarization part overlapping the second display region.

A method includes contacting an organic cured film with an acidic cleaning liquid including sulfuric acid and a water-soluble organic solvent and does not include a compound capable of generating nitronium ions. An amount of the sulfuric acid in the acidic cleaning liquid is 40% by mass or more, and an amount of water in the acidic cleaning liquid is 5% by mass or less.

A wire bonding apparatus includes: a first tensioner which forms, nearer a wire supply side than a bonding tool, a first gas flow for applying a tension toward the wire supply side on a wire; a second tensioner which forms, between the first tensioner and a pressing part of the bonding tool, a second gas flow for applying a tension toward the wire supply side on the wire; and a control part which controls the first tensioner and the second tensioner. The control part implements control, in a predetermined period after a first bonding step for bonding the wire to a first bonding point, to turn off at least the second gas flow of the second tensioner among the first tensioner and the second tensioner or to make at least the second gas flow smaller than in the first bonding step.

The present disclosure provides a chip transfer substrate, a chip transfer device and a chip transfer method. The chip transfer substrate includes a substrate, a plurality of bases spaced apart from each other on the substrate, the plurality of bases being configured to carry micro light emitting diodes (Micro LEDs) to be transferred and being movable on the substrate; and a plurality of distance adjusting components each arranged between two adjacent bases and configured to adjust a distance between the two adjacent bases.

The present disclosure provides an antenna packaging structure radiating electromagnetic waves in a horizontal direction parallel to the device plane and a method making the same. The method includes: providing a support substrate, and forming a separation layer; forming a rewiring layer on the separation layer; forming an antenna array layer on the rewiring layer, the antenna array layer is electrically connected to the metal wire layer; the antenna array layer includes a plurality of antennas which radiates e-m waves in a horizontal direction; each antennas comprises first metal sheets extending along a first direction and second metal sheets extending along a second direction, the first metal sheets are arranged with sheets in parallel and spaced by an sheet-to-sheet interval, second metal sheets are arranged with sheets in parallel and spaced by an sheet-to-sheet interval; forming a molding material layer, which molds the antenna array layer.

The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

A semiconductor device including a multilayer wiring layer comprising a first wiring, a first insulating film formed on the multilayer wiring layer and having a first opening exposing a portion of the first wiring, a second insulating film formed on the first insulating film and having a second opening continuing with the first opening, and an inductor formed of the first wiring, and a second wiring electrically connected with the first wiring through a via formed in the first opening. A side surface of the via contacts with the first insulating film, and does not contact with the second insulating film.

An apparatus for attaching an interconnector of a solar cell panel, includes an interconnector supply unit for unwinding the interconnector wound around a winding roll and moving the interconnector in a processing direction; and an attachment unit for attaching the interconnector to a solar cell, wherein the interconnector supply unit includes the winding roll, around which the interconnector is wound; and an unwinding control member for unwinding the interconnector from the winding roll, and wherein the unwinding control member allows the interconnector to be unwound so as to pass through one end of the winding roll in a longitudinal direction.