A horizontal substrate carrier is provided, for example a carrier for holding semiconductor substrates during horizontal thermal processing. The horizontal substrate carrier has asymmetrically placed support rails. One side of the horizontal substrate carrier has no upper rail while the other side of the horizontal substrate carrier has an upper rail placed at a relatively high location, for example at an angular location of 60° or more, more preferably of 70° or more, and most preferably at 90°. The side without an upper rail may be used for robotic loading of the horizontal substrate carrier. In a preferred embodiment, only three rails are provided: one upper rail on one side and two lower rails. The use and placement of these three rails can hold the substrate in precise uniform locations, minimize substrate movement, and minimize particle generation, all while allowing for easy robotic access.

According to one aspect of a technique the present disclosure, there is provided a processing apparatus including: an apparatus controller including a memory storing apparatus data containing monitor data containing sensor information and an alarm indicating a failure detected based on the sensor information and an alarm analysis table containing analysis items. The apparatus controller is capable of outputting the alarm containing an alarm ID for specifying a type and an occurrence time of the alarm; specifying candidates of the analysis items from the alarm ID; acquiring monitor data corresponding to the candidates; determining a rank of the cause of the alarm according to a difference between monitor data at the occurrence time and a predetermined threshold value; and displaying a relationship between the monitor data and the threshold value. The display screen displays an occurrence history of the alarm and history of acquiring the monitor data.

There is provided a technique capable of uniformly supplying a gas with respect to a surface of a substrate when the substrate is processed. According to one aspect thereof, there is provided a substrate processing apparatus including: a reaction tube; and a gas supply nozzle for supplying a gas to a substrate supported by a substrate support in the reaction tube along a direction parallel to a substrate surface. The gas supply nozzle is provided with a gas ejection port including an edge vicinity portion and a central portion defined along the direction parallel to the surface of the substrate. An opening dimension of the edge vicinity portion of the gas ejection port measured along a direction orthogonal to the direction parallel to the surface of the substrate is greater than an opening dimension of the central portion of the gas ejection port measured along the same direction.

A carrier boat for die package flux cleaning, including: a body having at least one pair of substantially parallel sides, the body comprising one or more die package receptacles each oriented at a non-parallel angle relative to the substantially parallel sides of the body such that, when a die package is seated in a die package receptacle of the one or more die package receptacles, a first pair of opposing sides of a die of the die package are substantially perpendicular to the substantially parallel sides,

According to one embodiment, a substrate processing apparatus includes a batch type cleaning unit, a holding unit, and a single-substrate type drying unit. The batch type cleaning unit simultaneously cleans a plurality of substrates in a batch process with a first liquid. The holding unit receives the cleaned substrates while still wet and then keeps a first surface of each of the substrates wet with the first liquid. The single-substrate type drying unit is configured to receive the substrates one by one from the holding unit and then dry off the substrates one by one.

A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to a position above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates that are exposed from the liquid surface. The controller changes an ejection flow rate of the vapor ejected by the ejector as the plurality of substrates are moved up.

A wafer boat according to the present disclosure includes a plurality of support columns, each having a pillar shape and comprising a plurality of grooves configured to have a wafer placed thereon, and support plates configured to support both end portions of the plurality of support columns, respectively. Each of the plurality of support columns are formed of a ceramic containing aluminum oxide or silicon carbide as a main constituent, and an outer side surface of the plurality of support columns is a ground surface and/or a polished surface.

A cassette for receiving at least one substrate for a display device includes a base; and a first wall extending in a direction generally perpendicular to an upper surface of the base and a plurality of first projections extending from the first wall in a first direction and arranged in a second direction generally perpendicular to the first direction at substantially regular intervals. A first opening is defined between adjacent first projections to receive one end of a first substrate, the first opening includes a first portion having a first width in the second direction and a second portion having a second width greater than the first width, and the first portion is disposed closer to the first wall than the second portion.

A substrate fixing device includes a first supporter supporting at least one substrate and a second supporter connected to the first supporter, making contact with a first surface and a second surface of the at least one substrate in a first direction, and vertically fixing the at least one substrate such that a third surface faces a normal line direction of the first supporter. The second supporter defines a deposition surface including the third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface in the at least one substrate and exposes the defined deposition surface to the deposition processing space. A deposition processing equipment including the substrate fixing device and a deposition processing method using the deposition processing equipment are also provided.

A cassette for receiving at least one substrate for a display device includes a base; and a first wall extending in a direction generally perpendicular to an upper surface of the base and a plurality of first projections extending from the first wall in a first direction and arranged in a second direction generally perpendicular to the first direction at substantially regular intervals. A first opening is defined between adjacent first projections to receive one end of a first substrate, the first opening includes a first portion having a first width in the second direction and a second portion having a second width greater than the first width, and the first portion is disposed closer to the first wall than the second portion.