Various embodiments provide a bonding pad structure that is capable of handling increased bonding loads. In one embodiment, the bonding pad structure includes a continuous metal layer, a first discontinuous metal layer, a second discontinuous metal layer, and dielectric material. The first discontinuous metal layer and the second discontinuous metal layer each include a plurality of holes that are arranged in a pattern. The plurality of holes of the first discontinuous metal layer overlaps at least two of the plurality of holes of the second discontinuous metal layer. The dielectric material is formed between the metal layers and fills the plurality of holes of the first and second discontinuous metal layers.

A display device includes a substrate including a pad area, a first conductive pattern disposed in the pad area on the substrate, an insulating layer disposed on the first conductive pattern and overlapping the first conductive pattern, second conductive patterns disposed on the insulating layer, spaced apart from each other, and contacting the first conductive pattern through contact holes formed in the insulating layer, and a third conductive pattern disposed on the second conductive patterns and contacting the insulating layer.