Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/02
Bonding areas; Manufacturing methods related thereto
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H01L2224/04
Structure, shape, material or disposition of the bonding areas prior to the connecting process
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H01L2224/05
of an individual bonding area
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H01L2224/05698
with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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H01L2224/057
with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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H01L2224/05701
the principal constituent melting at a temperature of less than 400°C
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H01L2224/05705
Gallium [Ga] as principal constituent
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H01L2224/05705

LIQUID METAL INTERCONNECTS FOR POWER SEMICONDUCTOR MODULES
20250379167 · 2025-12-11 ·

The disclosed subject matter relates to liquid metal interconnects for power semiconductor modules. For example, disclosed herein are semiconductor package devices, comprising: a semiconductor device comprising an electrode and/or contact pad; a solid metal circuit element; and a liquid metal interface comprising a liquid metal material. The liquid metal interface can append at least a portion of the solid metal circuit element to at least a portion of the electrode and/or contact pad within a contact area. Adhesive forces, cohesive forces, surface tension forces, capillary forces, viscosity, and/or wetting characteristics enable containment of the liquid metal interface within the contact area. Also disclosed herein are methods of making and use of any of the devices disclosed herein.