Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

Provided are an array substrate, a chip on film, a display panel and a display device. The array substrate has a display area and a bonding area located in a periphery of the display area. The array substrate includes a plurality of first bonding pads located in the bonding area, and length directions of the first bonding pads face the display area.

Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

Provided are an array substrate, a chip on film, a display panel and a display device. The array substrate has a display area and a bonding area located in a periphery of the display area. The array substrate includes a plurality of first bonding pads located in the bonding area, and length directions of the first bonding pads face the display area.