Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

In one embodiment, a semiconductor device includes a first wafer or a first chip including a first insulator and a first pad. The device further includes a second wafer or a second chip including a second insulator in contact with the first insulator, and a second pad opposed to the first pad and electrically connected to the first pad. Moreover, the first insulator includes a first trench extending to the first pad, and/or the second insulator includes a second trench extending to the second pad.

A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.

In one embodiment, a semiconductor device includes a first wafer or a first chip including a first insulator and a first pad. The device further includes a second wafer or a second chip including a second insulator in contact with the first insulator, and a second pad opposed to the first pad and electrically connected to the first pad. Moreover, the first insulator includes a first trench extending to the first pad, and/or the second insulator includes a second trench extending to the second pad.

The invention relates to a method (20) for producing an electric circuit (2) in which a circuit carrier (4) comprising a first contact surface (14) and a second contact surface (16) is provided. An insulating body (26) is placed on the circuit carrier (4), wherein the insulating body (26) at least partially covers the first contact surface (14) and the second contact surface (16), and the insulating body (26) comprises a recess (34) in the region of both contact surfaces (14, 16). A flowable electro-conductive medium (44) is introduced into the insulating body (26). The invention also relates to an electric circuit (2) and to a further method (60) for producing an electric circuit (2).

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.