A semiconductor package includes a chip level unit including a semiconductor chip; a medium level unit; and a solder ball unit. The solder ball unit is to be connected to a circuit substrate. The medium level unit includes: a wiring pad layer on a first protection layer; a second protection layer including a pad-exposing hole on the first protection layer, a post layer in the pad-exposing hole on the wiring pad layer; and a third protection layer including a post-exposing hole on the second protection layer. A width or diameter of the post-exposing hole is smaller than a width or diameter of the pad-exposing hole; and a barrier layer is disposed in the post-exposing hole on the post layer. The solder ball unit includes a solder ball on the barrier layer.

A semiconductor package includes a chip level unit including a semiconductor chip; a medium level unit; and a solder ball unit. The solder ball unit is to be connected to a circuit substrate. The medium level unit includes: a wiring pad layer on a first protection layer; a second protection layer including a pad-exposing hole on the first protection layer, a post layer in the pad-exposing hole on the wiring pad layer; and a third protection layer including a post-exposing hole on the second protection layer. A width or diameter of the post-exposing hole is smaller than a width or diameter of the pad-exposing hole; and a barrier layer is disposed in the post-exposing hole on the post layer. The solder ball unit includes a solder ball on the barrier layer.

The present invention discloses a welding method of a demetallized ceramic substrate having a surface capillary microgroove structure. The demetallized ceramic substrate includes a ceramic substrate main body and surface capillary microstructures. The surface capillary microstructures are arranged on two lateral sides of the ceramic substrate main body and the surface capillary microstructures specifically are capillary microgrooves. The welding method includes the following steps: fixing a chip to an upper surface of the demetallized ceramic substrate having the surface capillary microgroove structure, fixing the ceramic substrate with the chip to a printed circuit board having a bonding pad, and placing melted solder on the bonding pad, and driving the solder to ascend to an electrode of the chip from the bonding pad in a lower layer by means of a capillary force, thereby realizing an electrical connection between the chip and the printed circuit board.

A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.

A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a semiconductor die, a cap layer, a conductive terminal, and a dam structure. The semiconductor die has a first surface. The cap layer is over the semiconductor die and has a second surface facing the first surface of the semiconductor die. The conductive terminal penetrates the cap layer and electrically connects to the semiconductor die. The dam structure is between the semiconductor die and the cap layer and surrounds a portion of the conductive terminal between the first surface and the second surface, thereby forming a gap between the cap layer and the semiconductor die.

A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.

A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a semiconductor die, a cap layer, a conductive terminal, and a dam structure. The semiconductor die has a first surface. The cap layer is over the semiconductor die and has a second surface facing the first surface of the semiconductor die. The conductive terminal penetrates the cap layer and electrically connects to the semiconductor die. The dam structure is between the semiconductor die and the cap layer and surrounds a portion of the conductive terminal between the first surface and the second surface, thereby forming a gap between the cap layer and the semiconductor die.

The invention relates to a method (20) for producing an electric circuit (2) in which a circuit carrier (4) comprising a first contact surface (14) and a second contact surface (16) is provided. An insulating body (26) is placed on the circuit carrier (4), wherein the insulating body (26) at least partially covers the first contact surface (14) and the second contact surface (16), and the insulating body (26) comprises a recess (34) in the region of both contact surfaces (14, 16). A flowable electro-conductive medium (44) is introduced into the insulating body (26). The invention also relates to an electric circuit (2) and to a further method (60) for producing an electric circuit (2).

A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.

A stacked semiconductor structure is provided. The stacked semiconductor structure includes a substrate, a first electronic component, a first fillet, and a first redistribution layer. The substrate has a support surface. The substrate includes a first pad disposed on the support surface. The first electronic component is disposed on the support surface and has a first bottom surface, a first top surface, and a first side surface connecting the first bottom surface and the first top surface. The first electronic component includes a second pad disposed on the first top surface. The first fillet is disposed on the support surface and the first side surface and has a first inclined surface. The first redistribution layer is disposed on the support surface, the first top surface, and the first inclined surface and electrically connecting the first pad to the second pad.