H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L2224/28
Structure, shape, material or disposition of the layer connectors prior to the connecting process
H01L2224/28
Structure, shape, material or disposition of the layer connectors prior to the connecting process
H01L2224/2919
with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
H01L2224/2919
with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy