H ELECTRICITY
H01 ELECTRIC ELEMENTS
H01L SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
2224/00 Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/26 Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L2224/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
H01L2224/29 of an individual layer connector
H01L2224/29001 Core members of the layer connector
H01L2224/29198 with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams