Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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H01L2224/28
Structure, shape, material or disposition of the layer connectors prior to the connecting process
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H01L2224/2956

SENSOR DEVICE AND METHOD FOR MANUFACTURING SENSOR DEVICE
20240387437 · 2024-11-21 · ·

A sensor device includes a semiconductor sensor element and a substrate on which the semiconductor sensor element is mounted. The substrate includes a sensor-element mounted portion at which the semiconductor sensor element is mounted, and includes a first resist portion that surrounds the sensor-element mounted portion. The substrate includes a first region adjacent to the first resist portion and being covered with a resin layer, and includes a second resist portion that surrounds the first resist portion, the first region being interposed between the first resist portion and the second resist portion. The substrate includes at least one third resist portion extending from the first resist portion toward the second resist portion.