A semiconductor package includes a lower semiconductor chip and semiconductor chips in a stack on the lower semiconductor chip in a first direction perpendicular to a top surface of the lower semiconductor chip. Connection bumps are between the lower semiconductor chip and a bottommost one of the semiconductor chips and between the semiconductor chips, A protection layer covers a lateral surface of each of the connection bumps. A mold layer is on the lower semiconductor chip and covering lateral surfaces of the semiconductor chips. The mold layer extends between the bottommost one of the semiconductor chips and the lower semiconductor chip and between the semiconductor chips. The protection layer is between the mold layer and the lateral surface of each of the connection bumps.

The present disclosure provides a conductive particle and a preparation method thereof, a conductive adhesive and a display device. The preparation method comprises steps of: forming cores; dispersing the spherical cores in deionized water and adding organic polymeric monomers so as to form a reaction solution; radiating the reaction solution with rays so that the organic polymeric monomers are polymerized on surfaces of the cores so as to form organic polymers; separating the spherical cores formed with the organic polymers on their surfaces from the reaction solution so as to obtain them; successively carrying out preoxidation and carbonization treatment on the cores formed with the organic polymers on their surfaces so that the organic polymers form a conductive layer consisting of carbon particles so as to obtain conductive particles each consisting of the conductive layer and the core.

The present disclosure provides a conductive particle and a preparation method thereof, a conductive adhesive and a display device. The preparation method comprises steps of: forming cores; dispersing the spherical cores in deionized water and adding organic polymeric monomers so as to form a reaction solution; radiating the reaction solution with rays so that the organic polymeric monomers are polymerized on surfaces of the cores so as to form organic polymers; separating the spherical cores formed with the organic polymers on their surfaces from the reaction solution so as to obtain them; successively carrying out preoxidation and carbonization treatment on the cores formed with the organic polymers on their surfaces so that the organic polymers form a conductive layer consisting of carbon particles so as to obtain conductive particles each consisting of the conductive layer and the core.

A semiconductor package includes a lower semiconductor chip and semiconductor chips in a stack on the lower semiconductor chip in a first direction perpendicular to a top surface of the lower semiconductor chip. Connection bumps are between the lower semiconductor chip and a bottommost one of the semiconductor chips and between the semiconductor chips, A protection layer covers a lateral surface of each of the connection bumps. A mold layer is on the lower semiconductor chip and covering lateral surfaces of the semiconductor chips. The mold layer extends between the bottommost one of the semiconductor chips and the lower semiconductor chip and between the semiconductor chips. The protection layer is between the mold layer and the lateral surface of each of the connection bumps.