Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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H01L2224/31
Structure, shape, material or disposition of the layer connectors after the connecting process
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H01L2224/3314

FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
20250006652 · 2025-01-02 · ·

An apparatus comprising a first integrated circuit device, the first integrated circuit device comprising a first layer with an area comprising metallization and metal-free slits; and a fiducial in a second layer above the first layer, the fiducial formed over the area comprising the metallization and metal-free slits.