A semiconductor die is arranged at a die mounting location of an electrically conductive substrate. The electrically conductive substrate includes an array of electrically conductive leads having openings at the periphery of the electrically conductive substrate. An electrically conductive clip is arranged in a bridge-like position between the semiconductor die and an electrically conductive lead in the array of electrically conductive leads to provide electrical coupling therebetween. The electrically conductive clip has an end coupled to the electrically conductive lead, wherein the end includes: a planar proximal portion configured to contact the electrically conductive lead proximally of the openings, and a distal portion projecting beyond the proximal portion distally thereof, the distal portion provided with sculpturing configured to engage the openings to facilitate immobilizing the electrically conductive clip in the bridge-like position between the semiconductor chip and electrically conductive lead.