A semiconductor device according to an embodiment includes a base frame, a semiconductor element provided on the base frame, a connector provided on the semiconductor element, the connector having an upper surface, a side surface, and a porous body having a plurality of pores provided on at least the side surface, and a molded resin provided in a periphery of the semiconductor element and at least the side surface of the connector. The upper surface of the connector is exposed.

A semiconductor device according to an embodiment includes a base frame, a semiconductor element provided on the base frame, a connector provided on the semiconductor element, the connector having an upper surface, a side surface, and a porous body having a plurality of pores provided on at least the side surface, and a molded resin provided in a periphery of the semiconductor element and at least the side surface of the connector. The upper surface of the connector is exposed.

Provided is a semiconductor package in which a bonding structure is formed using metal grains included in metal powder layers having a coefficient of thermal expansion (CTE) similar with those of a substrate and a conductor so as to minimize generation of cracks and to improve reliability of bonded parts.

Provided is a semiconductor package in which a bonding structure is formed using metal grains included in metal powder layers having a coefficient of thermal expansion (CTE) similar with those of a substrate and a conductor so as to minimize generation of cracks and to improve reliability of bonded parts.

A semiconductor device according to an embodiment includes a base frame, a semiconductor element provided on the base frame, a connector provided on the semiconductor element, the connector having an upper surface, a side surface, and a porous body having a plurality of pores provided on at least the side surface, and a molded resin provided in a periphery of the semiconductor element and at least the side surface of the connector. The upper surface of the connector is exposed.

A semiconductor device according to an embodiment includes a base frame, a semiconductor element provided on the base frame, a connector provided on the semiconductor element, the connector having an upper surface, a side surface, and a porous body having a plurality of pores provided on at least the side surface, and a molded resin provided in a periphery of the semiconductor element and at least the side surface of the connector. The upper surface of the connector is exposed.

A semiconductor device includes a semiconductor element, leads, and an encapsulation resin covering a portion of each of the leads and the semiconductor element. Each of the leads includes an external connection portion projecting from a side surface of the encapsulation resin. The external connection portion of at least one of the leads has opposite ends in a width-wise direction that extends along the side surface of the encapsulation resin. The external connection portion includes two recesses arranged toward a center in the width-wise direction from the opposite ends. The two recesses extend from a distal surface toward the encapsulation resin. The opposite ends in the width-wise direction define an end connection part. The external connection portion includes a part between the two recesses defining a center connection part.

A semiconductor device includes a semiconductor element, leads, and an encapsulation resin covering a portion of each of the leads and the semiconductor element. Each of the leads includes an external connection portion projecting from a side surface of the encapsulation resin. The external connection portion of at least one of the leads has opposite ends in a width-wise direction that extends along the side surface of the encapsulation resin. The external connection portion includes two recesses arranged toward a center in the width-wise direction from the opposite ends. The two recesses extend from a distal surface toward the encapsulation resin. The opposite ends in the width-wise direction define an end connection part. The external connection portion includes a part between the two recesses defining a center connection part.

A semiconductor device includes a semiconductor element, leads, and an encapsulation resin covering a portion of each of the leads and the semiconductor element. Each of the leads includes an external connection portion projecting from a side surface of the encapsulation resin. The external connection portion of at least one of the leads has opposite ends in a width-wise direction that extends along the side surface of the encapsulation resin. The external connection portion includes two recesses arranged toward a center in the width-wise direction from the opposite ends. The two recesses extend from a distal surface toward the encapsulation resin. The opposite ends in the width-wise direction define an end connection part. The external connection portion includes a part between the two recesses defining a center connection part.

A semiconductor device includes a semiconductor element, leads, and an encapsulation resin covering a portion of each of the leads and the semiconductor element. Each of the leads includes an external connection portion projecting from a side surface of the encapsulation resin. The external connection portion of at least one of the leads has opposite ends in a width-wise direction that extends along the side surface of the encapsulation resin. The external connection portion includes two recesses arranged toward a center in the width-wise direction from the opposite ends. The two recesses extend from a distal surface toward the encapsulation resin. The opposite ends in the width-wise direction define an end connection part. The external connection portion includes a part between the two recesses defining a center connection part.