Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/34
Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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H01L2224/39
Structure, shape, material or disposition of the strap connectors after the connecting process
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H01L2224/40
of an individual strap connector
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H01L2224/40475
connected to auxiliary connecting means on the bonding areas
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H01L2224/40477
being a pre-ball (i.e. a ball formed by capillary bonding)
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H01L2224/4048
outside the semiconductor or solid-state body
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H01L2224/4048

Package with vertical interconnect between carrier and clip
20170317016 · 2017-11-02 ·

A package comprising a chip carrier, an electronic chip on the chip carrier, a clip on the electronic chip, an encapsulant at least partially encapsulating the electronic chip, and an electrically conductive vertical connection structure provided separately from the clip and electrically connecting the chip carrier with the clip.

Package with vertical interconnect between carrier and clip
10707158 · 2020-07-07 · ·

A package comprising a chip carrier, an electronic chip on the chip carrier, a clip on the electronic chip, an encapsulant at least partially encapsulating the electronic chip, and an electrically conductive vertical connection structure provided separately from the clip and electrically connecting the chip carrier with the clip.