Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/63
Connectors not provided for in any of the groups H01L2224/10 - H01L2224/50 and subgroups; Manufacturing methods related thereto
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H01L2224/65
Structure, shape, material or disposition of the connectors prior to the connecting process
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H01L2224/65

Hybrid bonded interconnect bridging
11676940 · 2023-06-13 · ·

A chip for hybrid bonded interconnect bridging for chiplet integration, the chip comprising: a first chiplet; a second chiplet; an interconnecting die coupled to the first chiplet and the second chiplet through a hybrid bond.

HYBRID BONDED INTERCONNECT BRIDGING
20220052023 · 2022-02-17 ·

A chip for hybrid bonded interconnect bridging for chiplet integration, the chip comprising: a first chiplet; a second chiplet; an interconnecting die coupled to the first chiplet and the second chiplet through a hybrid bond.