A production method of an exhaust gas purification device includes the steps of supplying a solution containing a catalyst metal from a shower nozzle to an upper part of a honeycomb substrate, coating the honeycomb substrate with the solution, and firing the honeycomb substrate coated with the solution, wherein the shower nozzle has a plurality of discharge openings for discharging the solution and a guard which surrounds the plurality of discharge openings.

An apparatus and a method for chip-to-wafer integration is provided. The apparatus includes a coating module, a bonding module and a cleaning module. The method includes the steps of placing at least one chip on a wafer to form an integrated product, forming a film on the integrated product, such that the integrated product is substantially fluid-tight, and exerting a predetermined positive pressure on the film during permanent bonding of the at least one chip to the wafer. The method further includes the step of removing the film from the integrated product after permanent bonding of the at least one chip to the wafer.