An apparatus is described for carrying out controlled local heating a target surface of a substrate provided with a heat sensitive material to change a state of the heat sensitive material. The apparatus includes a carrier having a carrier surface for carrying the substrate at a carried surface opposite the target surface. The carrier has a plurality of laterally distributed heating zones that are thermally insulated from each other by slits that are in communication with an evacuation channel. The respective heating zones include respective resistive heating elements and are thermally coupled to a heat sink. The apparatus further includes a controller configured to control a selective supply of electric energy to at least one of the respective resistive heating elements of at least one of the plurality of laterally distributed heating zones.

The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.