A mounting head for bonding a chip to a bonding target includes: a mounting tool having a bottom surface which functions as a suction surface for sucking and holding the chip; a heater arranged on an upper surface of the mounting tool and heating the mounting tool; a cooling mechanism having a plurality of cooling channels which are independent of one another and guide a refrigerant respectively to a plurality of cooling areas set in the heater, and being capable of cooling the plurality of cooling areas independently of one another; and a controller controlling driving of the heater and the cooling mechanism. The controller independently controls a flow rate of the refrigerant flowing through the plurality of cooling channels so as to obtain a desired temperature distribution during heating of the heater.

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

A semiconductor chip includes a semiconductor body having a bottom side and a top side opposite the bottom side, and passivation arranged on the top side. The semiconductor chip is positioned on the carrier by picking the semiconductor chip and placing the semiconductor chip on the carrier, and pressing the semiconductor chip onto the carrier by a pressing force in a pressing direction, such that the pressing force acts on the semiconductor chip only above one or more continuous chip metallization sections arranged on the top side. Each of the one or more continuous chip metallization sections includes an annularly closed edge section which has a minimum width of more than zero in each direction perpendicular to the pressing direction. The pressing force does not act on the semiconductor chip above any of the edge sections.

Co-planarity adjustment systems and methods, gantries capable of applying high force without imposing moment loads to their bearings, systems and methods for achieving rapid heating and cooling and efficient slidable seal systems capable of sealing a chamber and injecting one or more fluids into the chamber as well as actively recovering portions of such fluid which have migrated into the seal itself are disclosed in the context of thermo-compression bonding systems, apparatuses and methods, although many alternative uses will be apparent to those of skill in the art.

A semiconductor device manufacturing device (10) comprises: a stage (16) on which a substrate (100) is loaded; a bonding head (14) that is disposed facing the stage (16) and that bonds a semiconductor chip (110) to the substrate (100); and a controller (18). The bonding head (14) includes: an attachment (33) that holds the semiconductor chip (110) by suctioning; and a heating part (31) that detachably holds the attachment (33) and that heats the attachment (33). The heating part (31) has a first heating area (32a) and a second heating area (32b) that surrounds the first heating area (32a) in the horizontal direction. The controller (18) controls the temperatures of the first heating area (32a) and the second heating area (32b) independently.

An apparatus for handling microelectronic devices comprises a pick arm having a pick surface configured for receiving a microelectronic device thereon, drives for moving the pick arm and reorienting the pick surface in the X, Y and Z planes and about a horizontal rotational axis and a vertical rotational axis, and a sensor device carried by the pick arm and configured to detect at least one of at least one magnitude of force and at least one location of force applied between the pick surface and a structure contacted by the pick surface or a structure and a microelectronic device carried on the pick surface.

A semiconductor chip includes a semiconductor body having a bottom side and a top side opposite the bottom side, and passivation arranged on the top side. The semiconductor chip is positioned on the carrier by picking the semiconductor chip and placing the semiconductor chip on the carrier, and pressing the semiconductor chip onto the carrier by a pressing force in a pressing direction, such that the pressing force acts on the semiconductor chip only above one or more continuous chip metallization sections arranged on the top side. Each of the one or more continuous chip metallization sections includes an annularly closed edge section which has a minimum width of more than zero in each direction perpendicular to the pressing direction. The pressing force does not act on the semiconductor chip above any of the edge sections.

A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.