According to one embodiment, in a semiconductor manufacturing apparatus, a controller relatively moves a bonding tool and a stage close to each other while causing a semiconductor chip to adhere by suction to a surface via a tape using at least a first suction structure in a first period. In a second period, the controller controls the temperature of the bonding tool to a first target temperature while keeping substantially equal to a target pressure a pressure applied to the semiconductor chip by the bonding tool. In a third period, the controller controls a relative distance between the bonding tool and the stage so that the pressure applied to the semiconductor chip by the bonding tool is kept equal to the target pressure and controls the temperature of the bonding tool to a second target temperature. The second target temperature is higher than the first target temperature.

According to one embodiment, in a semiconductor manufacturing apparatus, a controller relatively moves a bonding tool and a stage close to each other while causing a semiconductor chip to adhere by suction to a surface via a tape using at least a first suction structure in a first period. In a second period, the controller controls the temperature of the bonding tool to a first target temperature while keeping substantially equal to a target pressure a pressure applied to the semiconductor chip by the bonding tool. In a third period, the controller controls a relative distance between the bonding tool and the stage so that the pressure applied to the semiconductor chip by the bonding tool is kept equal to the target pressure and controls the temperature of the bonding tool to a second target temperature. The second target temperature is higher than the first target temperature.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

Proposed is a method for controlling a boat carrier/substrate strip type solder ball placement system that allows solder ball mounting processes for a boat carrier type of a material and a substrate strip type of a material to be all performed in one system. In specific, the method allows the components or operation setting of the system to be automatically controlled according to the types of materials loaded on a magazine, thereby performing solder ball mounting processes for the two types of materials with high speed and high accuracy. In more specific, the method allows a component applied only to the solder ball mounting process for the boat carrier type of material and a component applied to the solder ball mounting process for the substrate strip type of material to be integrated with each other as a single component in the process of mounting the solder balls on the material on-loaded, thereby making it possible to perform the solder ball mounting processes for the two different types of materials in one system.

A method of manufacturing a semiconductor package includes estimating an error in a solder ball attaching process, determining a specification of a ball tool and a method of the solder ball attaching process, based on the estimated error, manufacturing the ball tool according to the determined specification thereof, and performing the solder ball attaching process based on the method of the solder ball attaching process. The determining of the specification of the ball tool and the method of the solder ball attaching process includes determining a number of a plurality of holders in the ball tool and a position and a width of each of the plurality of holders, determining a number of a plurality of working regions of a substrate and a position and a width of each of the plurality of working regions, and dividing a substrate into the plurality of working regions.

At least one semiconductor chip or die is held within at a chip retaining formation provided in a chip holding device. The chip holding device is then positioned with the at least one semiconductor chip or die arranged facing a chip attachment location in a chip mounting substrate. This positioning produces a cavity between the at least one semiconductor chip or die arranged at the chip retaining formation and the chip attachment location in the chip mounting substrate. A chip attachment material is dispensed into the cavity. Once cured, the chip attachment material attaches the at least one semiconductor chip or die onto the substrate at the chip attachment location in the chip mounting substrate.

While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.