Discussed is an assembly apparatus for assembling a semiconductor light emitting diode to a display panel, the assembly apparatus including an assembly module including at least one magnetic member and a magnetic member accommodator having at least one magnetic member accommodation hole, and a rotary module connected to the assembly module to rotate the assembly module along an orbit.

A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

A light emitting diode chip mounting apparatus includes a guide plate including a first surface and a second surface opposite to the first surface, the second surface including at least one first tunnel that extends in a first direction, wherein the first tunnel defines a concave portion and the second surface includes a convex portion adjacent to the concave portion. The first tunnel is sized to accommodate a light emitting diode chip flowing therethrough.

A cell of fluidic assembly of microchips on a substrate, including: a base having its upper surface intended to receive the substrate; a body laterally delimiting a fluidic chamber above the substrate; and a cover closing the fluidic chamber from its upper surface, wherein the body comprises first and second nozzles respectively emerging onto opposite first and second lateral edges of the fluidic chamber, each of the first and second nozzles being adapted to injecting and/or sucking in a liquid suspension of microchips into and/or from the fluidic chamber, in a direction parallel to the mean plane of the substrate.

An apparatus for aligning dipoles is provided. The apparatus includes: an electric field forming unit including a stage and a probe unit, the probe unit being configured to form an electric field on the stage; an inkjet printing device including an inkjet head, the inkjet head being configured to spray ink including a solvent and dipoles dispersed in the solvent onto the stage; a light irradiation device configured to irradiate light onto the stage; and a temperature control device including a temperature control unit, the temperature control unit being configured to control a temperature of the solvent sprayed on the stage.

A device for picking and placing semiconductor chips includes a liquid having a first surface and a second surface and a layer of semiconductor chips disposed over the first surface. Characteristically, the first surface is a liquid-air interface. The device also includes a focused ultrasonic transducer positioned to focus acoustic wave on the layer of semiconductor chips such that a droplet including at least one semiconductor chip is ejected through the liquid-air per each actuation of the focused ultrasonic transducer through droplet ejection. The focused ultrasonic transducer includes a piezoelectric substrate having a top face and a bottom face, a Fresnel acoustic lens including a plurality of annular rings of air cavities disposed on the top face, and a first patterned circular electrode disposed over the top face and a second patterned circular electrode disposed over the bottom face. The first patterned circular electrode overlaps the second patterned circular electrode.

A pick-up device has a caves. A first magnetic force is capable of attracting micro-devices to move toward the caves of the pick-up device. The pick-up device is disposed on a pick-up roller, and the pick-up roller drives the caves of the pick-up device to move relative to the micro-devices. Given that the first magnetic force is provided, the pick-up device compresses the micro-devices, so that the micro-devices are fitted in place the micro-devices into the caves of the pick-up device, wherein a shape of the caves is the same as a shape of the micro-devices. The micro-devices are transferred from the caves of the pick-up device to a receiving device.

An apparatus for aligning dipoles is provided. The apparatus includes: an electric field forming unit including a stage and a probe unit, the probe unit being configured to form an electric field on the stage; an inkjet printing device including an inkjet head, the inkjet head being configured to spray ink including a solvent and dipoles dispersed in the solvent onto the stage; a light irradiation device configured to irradiate light onto the stage; and a temperature control device including a temperature control unit, the temperature control unit being configured to control a temperature of the solvent sprayed on the stage.

An apparatus for aligning dipoles is provided. The apparatus includes: an electric field forming unit including a stage and a probe unit, the probe unit being configured to form an electric field on the stage; an inkjet printing device including an inkjet head, the inkjet head being configured to spray ink including a solvent and dipoles dispersed in the solvent onto the stage; a light irradiation device configured to irradiate light onto the stage; and a temperature control device including a temperature control unit, the temperature control unit being configured to control a temperature of the solvent sprayed on the stage.

Discussed is a device for self-assembling semiconductor light-emitting diodes for placing the semiconductor light-emitting diodes at predetermined positions on a substrate by using an electric field and a magnetic field, the substrate being accommodated in an assembly chamber accommodating a fluid, the device including a substrate chuck configured to dispose the substrate at an assembly position, wherein the substrate chuck includes a substrate support part configured to support the substrate on which an assembly electrode is formed, a rotating part configured to support the substrate support part, and a controller configured to control driving of the substrate chuck, wherein the substrate support part includes micro-holes for injecting a gas between the fluid and the substrate, and wherein the controller controls whether the gas is injected through the micro-holes according to whether the substrate is raised or lowered.