Discussed is an assembly apparatus for assembling a semiconductor light emitting diode to a display panel, the assembly apparatus including an assembly module including at least one magnetic member and a magnetic member accommodator having at least one magnetic member accommodation hole, and a rotary module connected to the assembly module to rotate the assembly module along an orbit.

A method and device for the alignment of substrates that are to be bonded. The method includes detecting and storing positions of alignment mark pairs located on surfaces of the substrates, and aligning the substrates with respect to each other in accordance with the detected positions.

An assembly apparatus for assembling a semiconductor light emitting diode to a display panel according to an embodiment of the present disclosure includes: an assembly module including at least one magnetic member coming in contact with a surface of the display, and a magnetic member accommodator having at least one magnetic member accommodation hole; and a rotary module connected to the assembly module and configured to rotate the assembly module along an orbit on the basis of a driving force transmitted from an external driving source.

A method and device for the alignment of substrates that are to be bonded. The method includes detecting and storing positions of alignment mark pairs located on surfaces of the substrates. and aligning the substrates with respect to each other in accordance with the detected positions.

Methods of and systems for assembling a plurality of ferromagnetic components into a grid-array are provided. One method includes applying a vibratory force to a magnetic stage, the magnetic stage comprising a plurality of magnets and spacers arranged in an array; depositing a plurality of ferromagnetic components, each having a ferromagnetic strip, onto the magnetic stage, the vibratory force distributing the plurality of the ferromagnetic components substantially evenly across a surface of the magnetic stage, and wherein the vibratory force aligns at least one of the plurality of ferromagnetic components with a node of maximum magnetic field strength of the magnetic stage; and removing a set of the plurality of ferromagnetic components that are not in a node of maximum magnetic field strength through physical inversion of the magnetic stage.

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.