An adsorption device includes a substrate and a magnetic film on a surface of the substrate. The substrate has magnetic properties and is capable of generating magnetic field. The magnetic film partially covers the surface. The magnetic film generates a magnetic field having a direction that is opposite to a direction of the magnetic field generated by the substrate. Portions of the surface of the substrate not covered by the magnetic film form positions to attract and adsorb target objects, and other portion of the surface of the substrate covered by the magnetic film is not able to attract any target object.

A method and device for the alignment of substrates that are to be bonded. The method includes detecting and storing positions of alignment mark pairs located on surfaces of the substrates, and aligning the substrates with respect to each other in accordance with the detected positions.

An adsorption device includes a substrate and a magnetic film on a surface of the substrate. The substrate has magnetic properties and is capable of generating magnetic field. The magnetic film partially covers the surface. The magnetic film generates a magnetic field having a direction that is opposite to a direction of the magnetic field generated by the substrate. Portions of the surface of the substrate not covered by the magnetic film form positions to attract and adsorb target objects, and other portion of the surface of the substrate covered by the magnetic film is not able to attract any target object.

A method of aligning semiconductor dies having metallic bumps in a mold chase for further processing. A plurality of semiconductor dies are placed in the mold chase at approximately desired locations for further processing. A plurality of magnets in a retainer are associated with the mold chase, the plurality of magnets being associated with respective ones of the plurality of semiconductor dies. The magnetic field of the magnets is applied to align and hold the plurality of dies at the desired location. The plurality of magnets may be adjustably mounted in the retainer so that they can be adjusted to more precisely align the semiconductor dies at the desired locations.

A method and device for the alignment of substrates that are to be bonded. The method includes detecting and storing positions of alignment mark pairs located on surfaces of the substrates. and aligning the substrates with respect to each other in accordance with the detected positions.

A method of aligning semiconductor dies having metallic bumps in a mold chase for further processing. A plurality of semiconductor dies are placed in the mold chase at approximately desired locations for further processing. A plurality of magnets in a retainer are associated with the mold chase, the plurality of magnets being associated with respective ones of the plurality of semiconductor dies. The magnetic field of the magnets is applied to align and hold the plurality of dies at the desired location. The plurality of magnets may be adjustably mounted in the retainer so that they can be adjusted to more precisely align the semiconductor dies at the desired locations.

According to one embodiment, there is provided a substrate bonding apparatus including a first chuck stage and a second chuck stage. The first chuck stage includes a first electromagnetic force generation unit. The first chuck stage is chuckable for a first substrate. The second chuck stage includes a second electromagnetic force generation unit. The second electromagnetic force generation unit faces the first electromagnetic force generation unit. The second chuck stage is chuckable for a second substrate.