A method of making a secure integrated-circuit system comprises providing a first integrated circuit in a first die having a first die size and providing a second integrated circuit in a second die. The second die size is smaller than the first die size. The second die is transfer printed onto the first die and connected to the first integrated circuit, forming a compound die. The compound die is packaged. The second integrated circuit is operable to monitor the operation of the first integrated circuit and provides a monitor signal responsive to the operation of the first integrated circuit. The first integrated circuit can be constructed in an insecure facility and the second integrated circuit can be constructed in a secure facility.

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.

A magnetic apparatus includes a first structure including a first non-magnetic material, a second structure including a second non-magnetic material on a first portion of the first structure, a third structure including the second non-magnetic material on a second portion of the first structure. The magnetic apparatus further includes a first magnetic structure adjacent to a first sidewall of the second structure, a second magnetic structure adjacent to a first sidewall of the third structure, a third magnetic structure adjacent to a second sidewall of the second structure, adjacent to a second sidewall of the third structure and extends onto a third portion of the first structure. A magnet is coupled with the first, second and third magnetic structures.

A magnetic apparatus includes a first structure including a first non-magnetic material, a second structure including a second non-magnetic material on a first portion of the first structure, a third structure including the second non-magnetic material on a second portion of the first structure. The magnetic apparatus further includes a first magnetic structure adjacent to a first sidewall of the second structure, a second magnetic structure adjacent to a first sidewall of the third structure, a third magnetic structure adjacent to a second sidewall of the second structure, adjacent to a second sidewall of the third structure and extends onto a third portion of the first structure. A magnet is coupled with the first, second and third magnetic structures.

Discussed is a device for self-assembling semiconductor light-emitting diodes for placing the semiconductor light-emitting diodes at predetermined positions on a substrate by using an electric field and a magnetic field, the substrate being accommodated in an assembly chamber accommodating a fluid, the device including a substrate chuck configured to dispose the substrate at an assembly position, wherein the substrate chuck includes a substrate support part configured to support the substrate on which an assembly electrode is formed, a rotating part configured to support the substrate support part, and a controller configured to control driving of the substrate chuck, wherein the substrate support part includes micro-holes for injecting a gas between the fluid and the substrate, and wherein the controller controls whether the gas is injected through the micro-holes according to whether the substrate is raised or lowered.

A method for transferring light emitting elements during manufacture of a display panel includes providing light emitting elements; providing a first electromagnetic plate defining adsorption positions; providing a receiving substrate defining receiving areas; energizing the first electromagnetic plate to magnetically adsorb one of the light emitting elements at each adsorption position; facing the first electromagnetic plate to the receiving substrate; and transferring the light emitting elements to one corresponding receiving area of the receiving substrate.

Discussed is a device for self-assembling semiconductor light-emitting diodes includes a substrate chuck that is provided in an assembly chamber and supports a substrate and disposes the substrate at an assembly position, wherein the substrate chuck sucks or injects a gas present between the substrate and a fluid during loading and unloading of the substrate.

A magnetic apparatus includes a first structure including a first non-magnetic material, a second structure including a second non-magnetic material on a first portion of the first structure, a third structure including the second non-magnetic material on a second portion of the first structure. The magnetic apparatus further includes a first magnetic structure adjacent to a first sidewall of the second structure, a second magnetic structure adjacent to a first sidewall of the third structure, a third magnetic structure adjacent to a second sidewall of the second structure, adjacent to a second sidewall of the third structure and extends onto a third portion of the first structure. A magnet is coupled with the first, second and third magnetic structures.

A magnetic apparatus includes a first structure including a first non-magnetic material, a second structure including a second non-magnetic material on a first portion of the first structure, a third structure including the second non-magnetic material on a second portion of the first structure. The magnetic apparatus further includes a first magnetic structure adjacent to a first sidewall of the second structure, a second magnetic structure adjacent to a first sidewall of the third structure, a third magnetic structure adjacent to a second sidewall of the second structure, adjacent to a second sidewall of the third structure and extends onto a third portion of the first structure. A magnet is coupled with the first, second and third magnetic structures.

A semiconductor manufacturing apparatus includes a stage capable of holding thereon an interconnection substrate. A tool presses the interconnection substrate and a semiconductor chip against each other between the tool and the stage. The tool includes a main body portion that has a holding surface holding thereon the semiconductor chip. A first protruding portion is provided along an outer edge of the holding surface and protrudes from the holding surface toward the stage. A second protruding portion is provided outside of the first protruding portion along the outer edge of the holding surface and protrudes from the holding surface toward the stage. A groove portion is provided between the first protruding portion and the second protruding portion.