Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/74
Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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H01L2224/76
Apparatus for connecting with build-up interconnects
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H01L2224/76501
in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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H01L2224/76501

Apparatus and method for cooling substrate
11456192 · 2022-09-27 · ·

The inventive concept relates to a substrate cooling apparatus for cooling a substrate. The substrate cooling apparatus includes a chuck on which the substrate is placed and a cooling unit that cools the chuck. The cooling unit includes a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck.

APPARATUS AND METHOD FOR COOLING SUBSTRATE
20210035828 · 2021-02-04 · ·

The inventive concept relates to a substrate cooling apparatus for cooling a substrate. The substrate cooling apparatus includes a chuck on which the substrate is placed and a cooling unit that cools the chuck. The cooling unit includes a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck.