Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/74
Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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H01L2224/76
Apparatus for connecting with build-up interconnects
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H01L2224/7665
Means for transporting the components to be connected
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H01L2224/76655

INK LEVELING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
20220223562 · 2022-07-14 · ·

An ink leveling device includes a stage on which a target substrate is disposed, base frames disposed at sides of the stage, moving members coupled to the base frames and movable upward and downward, and at least one plate coupled to the moving members and disposed to press the target substrate. Light-emitting element ink is disposed on the target substrate.

Ink leveling device and method of manufacturing display device using the same
12113047 · 2024-10-08 · ·

An ink leveling device includes a stage on which a target substrate is disposed, base frames disposed at sides of the stage, moving members coupled to the base frames and movable upward and downward, and at least one plate coupled to the moving members and disposed to press the target substrate. Light-emitting element ink is disposed on the target substrate.