Semiconductor dice are arranged on a substrate such as a leadframe. Each semiconductor die is provided with electrically-conductive protrusions (such as electroplated pillars or bumps) protruding from the semiconductor die opposite the substrate. Laser direct structuring material is molded onto the substrate to cover the semiconductor dice arranged thereon, with the molding operation leaving a distal end of the electrically-conductive protrusion to be optically detectable at the surface of the laser direct structuring material. Laser beam processing the laser direct structuring material is then performed with laser beam energy applied at positions of the surface of the laser direct structuring material which are located by using the electrically-conductive protrusions optically detectable at the surface of the laser direct structuring material as a spatial reference.

An apparatus for securing a wafer includes a chuck, at least one O-ring disposed on the chuck, a vacuum system connected to the chuck, such that the vacuum system comprises a plurality of vacuum holes through the chuck connected to one or more vacuum pumps, and a controller configured to control the height of the at least one O-ring relative to the top surface of the chuck. The controller is connected to pressure sensors capable of detecting a vacuum. The at least one O-ring may include a plurality of O-rings.

An apparatus for securing a wafer includes a chuck, at least one O-ring disposed on the chuck, a vacuum system connected to the chuck, such that the vacuum system comprises a plurality of vacuum holes through the chuck connected to one or more vacuum pumps, and a controller configured to control the height of the at least one O-ring relative to the top surface of the chuck. The controller is connected to pressure sensors capable of detecting a vacuum. The at least one O-ring may include a plurality of O-rings.

A method includes, receiving a layout design of at least part of an electronic module, the design specifying at least (i) an electronic device coupled to at least a substrate, and (ii) an electrical trace that is connected to the electronic device and has a designed route. A digital input, which represents at least part of an actual electronic module that was manufactured in accordance with the layout design but without at least a portion of the electrical trace, is received. An error in coupling the electronic device to the substrate, relative to the layout design, is estimated based on the digital input. An actual route that corrects the estimated error, is calculated for at least the portion of the electrical trace. At least the portion of the electrical trace is formed on the substrate of the actual electronic module, along the actual route instead of the designed route.

A method includes, receiving a layout design of at least part of an electronic module, the design specifying at least (i) an electronic device coupled to at least a substrate, and (ii) an electrical trace that is connected to the electronic device and has a designed route. A digital input, which represents at least part of an actual electronic module that was manufactured in accordance with the layout design but without at least a portion of the electrical trace, is received. An error in coupling the electronic device to the substrate, relative to the layout design, is estimated based on the digital input. An actual route that corrects the estimated error, is calculated for at least the portion of the electrical trace. At least the portion of the electrical trace is formed on the substrate of the actual electronic module, along the actual route instead of the designed route.

The disclosure relates to systems, and methods for improving connectivity of embedded components. Specifically, the disclosure relates to systems and methods for using additive manufacturing to improve connectivity of embedded components with the host structure and/or other embedded components by selectably bridging the gap naturally formed due to manufacturing variation and built in tolerances, between the embedded components or devices and the host structure, and between one embedded component and a plurality of other embedded components.

Semiconductor dice are arranged on a substrate such as a leadframe. Each semiconductor die is provided with electrically-conductive protrusions (such as electroplated pillars or bumps) protruding from the semiconductor die opposite the substrate. Laser direct structuring material is molded onto the substrate to cover the semiconductor dice arranged thereon, with the molding operation leaving a distal end of the electrically-conductive protrusion to be optically detectable at the surface of the laser direct structuring material. Laser beam processing the laser direct structuring material is then performed with laser beam energy applied at positions of the surface of the laser direct structuring material which are located by using the electrically-conductive protrusions optically detectable at the surface of the laser direct structuring material as a spatial reference.

A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

An apparatus for securing a wafer includes a chuck, at least one O-ring disposed on the chuck, a vacuum system connected to the chuck, such that the vacuum system comprises a plurality of vacuum holes through the chuck connected to one or more vacuum pumps, and a controller configured to control the height of the at least one O-ring relative to the top surface of the chuck. The controller is connected to pressure sensors capable of detecting a vacuum. The at least one O-ring may include a plurality of O-rings.

A scanning alignment apparatus and scanning methods thereof are disclosed. The scanning alignment apparatus is used to scan a substrate and includes a transflective lens unit, an imaging element unit, an alignment lens unit and an illumination lens unit. The alignment lens unit includes a plurality of sub-alignment lens units, and the imaging element unit includes a plurality of imaging elements. Each of the sub-alignment lens units corresponds to a respective one of the imaging elements. The scanning alignment apparatus and scanning methods provided in the present invention can achieve higher scanning efficiency and thus enhanced productivity and product throughput.