A semiconductor device manufacturing method, includes: a preparing process for preparing a conductive plate, a semiconductor chip arranged over the conductive plate with a first bonding material therebetween, and a connection terminal including a bonding portion arranged over the semiconductor chip with a second bonding material therebetween; a first jig arrangement process for arranging a first guide jig, through which a first guide hole pierces, over the conductive plate, such that the first guide hole corresponds to the bonding portion in a plan view of the semiconductor device; and a first pressing process for inserting a pillar-shaped pressing jig, which includes a pressing portion at a lower end portion thereof, into the first guide hole, and pressing the bonding portion of the connection terminal to a side of the conductive plate with the pressing portion.

The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.

Embodiments relate to an integrated circuit package having an integrated circuit die connected to a package substrate through conductors of a flex cable. The flex cable includes an insulating housing made of an insulating material and a plurality of conductors disposed inside the insulating housing. Each conductor of the plurality of conductors is connected to a first contact of a plurality of contacts of the integrated circuit die and a second contact of a plurality of contacts of the package substrate.

The present disclosure provides a chip packaging device, a chip packaging method, and a package chip, and is related to a technical field of chip packaging. The chip packaging device includes conductive sheets, a vacuum suction movable assembly defining a variable suction surface, and a heating assembly. The variable suction surface sucks the plurality of conductive sheets. A first end of each of the conductive sheets is disposed above a corresponding bonding pads. A second end of each of the conductive sheets is disposed above a corresponding welding pin, so that when the variable suction surface is pressed down, the first end of each of the conductive sheets is pressed onto the corresponding bonding pad, and the second end of each of the conductive sheets is pressed onto the corresponding welding pin. The heating assembly heats solders on the bonding pads and the welding pins.

The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.

The present invention relates to an apparatus for bonding clips, a method of bonding clips, and a semiconductor package including semiconductor chips to which the clips are bonded using the method, and more particularly, to an apparatus for bonding clips, a method of bonding clips, and a semiconductor package including semiconductor chips to which the clips are bonded using the method, wherein the clips are sequentially bonded to the semiconductor chips by 1 unit so that a pitch difference between a lead frame array and a clip array is separately corrected to be the same and thereby, misalignment may be minimized so as to increase bonding accuracy of the clips to the semiconductor chips.

Embodiments relate to an integrated circuit package having an integrated circuit die connected to a package substrate through conductors of a flex cable. The flex cable includes an insulating housing made of an insulating material and a plurality of conductors disposed inside the insulating housing. Each conductor of the plurality of conductors is connected to a first contact of a plurality of contacts of the integrated circuit die and a second contact of a plurality of contacts of the package substrate.